Abstract: A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer and an ink layer, the substrate is provided with an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.

Abstract: A light-emitting device includes a light-emitting assembly, a first adhesive film, and a second adhesive film. The light-emitting assembly includes a first PCB substrate, a first light-emitting chip, and second light-emitting chips. The first PCB substrate has a mounting surface on one side of the first PCB substrate. The first light-emitting chip and the second light-emitting chips are disposed on the mounting surface. The light emission angle of the first light-emitting chip is less than the light emission angle of each of the second light-emitting chips. The first adhesive film is disposed on the mounting surface. The first adhesive film covers the first light-emitting chip. The second adhesive film covers the second light-emitting chip. The second adhesive film covers and is connected to the light-emitting assembly and the first adhesive film. The refractive index of the first adhesive film is greater than the refractive index of the second adhesive film.

Abstract: A substrate module includes a first substrate on which pad groups and a test terminal are disposed; a driver chip disposed on a side of the first substrate facing away from the pad groups and the test terminal, where the driver chip is connected to the pad groups and the test terminal separately; a second substrate disposed on a side of the driver chip facing away from the first substrate, where pins are disposed on a side of the second substrate facing away from the first substrate, and the driver chip is connected to the pins; and a filling layer disposed between the first substrate and the second substrate and configured to enclose the driver chip.

Abstract: A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer, an ink layer and an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.

Abstract: Provided are an LED display module and a display device. The LED display module includes LED display units and a circuit board. Each LED display unit includes pixel units. Each pixel unit includes LED light-emitting chips. A surface of the circuit board is provided with a circuit layer. The circuit layer includes first wirings and second wirings that do not cross each other. A-electrodes of LED light-emitting chips in an i-th row of pixel units in a current LED display unit and in an i-th row of pixel units in a subsequent LED display unit are electrically connected by one first wiring. B-electrodes of LED light-emitting chips of a same color in a j-th column of pixel units in a current LED display unit and in a j-th column of pixel units in a subsequent LED display unit are electrically connected by one second wiring.