Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.

Abstract: A pressing-type pad structure and an electronic device using the same are provided. The pressing-type pad structure includes a pad component, an elastic element and a positioning element. The rotatable pad component is disposed on a housing of the electronic device and has at least two concave portions. The elastic element connects the housing and the pad component. The positioning element is elastically disposed on the housing. One end of the positioning element is leant against the pad component. When the electronic device is pressed or moved, an elastic force of the elastic element is applied to the pad component to drive the pad component to rotate. The positioning element is selectively inserted into one of the concave portions for fixing the pad component, so as to change the position of the electronic device.

Abstract: A pressing-type pad structure and an electronic device using the same are provided. The pressing-type pad structure includes a pad component, an elastic element and a positioning element. The rotatable pad component is disposed on a housing of the electronic device and has at least two concave portions. The elastic element connects the housing and the pad component. The positioning element is elastically disposed on the housing. One end of the positioning element is leant against the pad component. When the electronic device is pressed or moved, an elastic force of the elastic element is applied to the pad component to drive the pad component to rotate. The positioning element is selectively inserted into one of the concave portions for fixing the pad component, so as to change the position of the electronic device.

Abstract: A new method is proposed and demonstrated effectively in reducing the coercive field and internal field in association with bulk periodical poling of the congruent grown ferro-electric nonlinear optical crystal. By adequate doping with zinc oxide, the coercive field required for achieving 180° domain reversal and the internal field associated with the non-stoichiometric point defects in undoped congruent grown ferro-electric nonlinear optical crystals can be reduced by an order of magnitude.

Abstract: A phase lock device and method applicable to a data transmission system, particularly to a high speed transmission system are provided. Based on that the optimum operation margin for delaying data strobe is to shift the edge of data strobe to the middle region of data signal, the phase lock device and method suggest a solution, by analyzing the influence of environmental and operational conditions on delaying data strobe and system clock, to adapt delay element to the variation of environmental and operational conditions, so that the delay of data strobe is always in such a range that the data receiver can be enabled to do accurate and reliable data reading, regardless of external interference.