Abstract: This application discloses a liquid cooling heat dissipation plate and a liquid cooling electronic device, wherein the liquid cooling heat dissipation plate includes a cooling plate unit, a liquid inlet and a liquid outlet are provided at side walls of the cooling plate unit, the liquid inlet is in connection with the liquid outlet through a penetrating channel, and the penetrating channel respectively penetrates two opposite mounting surfaces of the cooling plate unit; further, a pair of fin bases are respectively lapped at positions on the two mounting surfaces corresponding to the same straight channel, and the seal plate unit is lapped at a position on the mounting surface corresponding to positions in the penetrating channel that are not covered by the fin base; and any two of the fin base, the seal plate unit, and the mounting surface are fastened by friction welding.

Abstract: A pouch packaged lithium-ion battery with a tooth-shaped sealing edge, including a main body, which includes an aluminum-plastic film arranged with a jelly roll disposed therein. The jelly roll includes a cathode, an anode and a film separating the two. The cathode, the film and the anode are winded and overlaid. A cathode tab and an anode tab are respectively arranged on both sides of the jelly roll. A middle part of the aluminum-plastic film extends toward an outside of the lithium-ion battery to form a sealing edge. The cathode tab and the anode tab extend horizontally and penetrate the sealing edge. A joint between the cathode/anode and the sealing edge is covered with a tab sealant. The sealing edge, the cathode tab and the anode tab are bent to attach to a surface of the main body. The surface of the sealing edge is arranged with tooth-shaped grooves.

Abstract: A skate includes an inverted groove-shaped base secured to a boot and including front and rear pins; an elongated frame including front and rear sets of a transverse inner groove and a transverse open groove communicating with the transverse inner groove, and a threaded hole on the transverse open groove of the front set wherein either pin is disposed in the transverse inner groove and the elongated frame abuts an underside of the base; and a locking device including a spring biased block member disposed in the transverse open groove of the front set and having two projections at two ends respectively, a screw driven through a positioning member into the threaded hole to fasten the positioning member in the transverse open groove of the front set so that the block member abuts the front pin to block same in an assembled state.

Abstract: A pouch packaged lithium-ion battery with a tooth-shaped sealing edge, including a main body, which includes an aluminum-plastic film arranged with a jelly roll disposed therein. The jelly roll includes a cathode, an anode and a film separating the two. The cathode, the film and the anode are winded and overlaid. A cathode tab and an anode tab are respectively arranged on both sides of the jelly roll. A middle part of the aluminum-plastic film extends toward an outside of the lithium-ion battery to form a sealing edge. The cathode tab and the anode tab extend horizontally and penetrate the sealing edge. A joint between the cathode/anode and the sealing edge is covered with a tab sealant. The sealing edge, the cathode tab and the anode tab are bent to attach to a surface of the main body. The surface of the sealing edge is arranged with tooth-shaped grooves.

Abstract: A rear brake assembly of a kick scooter includes a brake including an attaching member having an open end; and a visual warning device being a module and fastened in the attaching member by snapping. Also, the fastening of the visual warning device in the attaching member is done manually.

Abstract: A skate includes an inverted groove-shaped base secured to a boot and including front and rear pins; an elongated frame including front and rear sets of a transverse inner groove and a transverse open groove communicating with the transverse inner groove, and a threaded hole on the transverse open groove of the front set wherein either pin is disposed in the transverse inner groove and the elongated frame abuts an underside of the base; and a locking device including a spring biased block member disposed in the transverse open groove of the front set and having two projections at two ends respectively, a screw driven through a positioning member into the threaded hole to fasten the positioning member in the transverse open groove of the front set so that the block member abuts the front pin to block same in an assembled state.

Abstract: A rear brake assembly of a kick scooter includes a brake including an attaching member having an open end; and a visual warning device being a module and fastened in the attaching member by snapping. Also, the fastening of the visual warning device in the attaching member is done manually.

Abstract: A skate includes an inverted groove-shaped base secured to a boot and including front and rear pins; an elongated frame including front and rear sets of a transverse inner groove and a transverse open groove communicating with the transverse inner groove, and a threaded hole on the transverse open groove of the front set wherein either pin is disposed in the transverse inner groove and the elongated frame abuts an underside of the base; and a locking device including a spring biased block member disposed in the transverse open groove of the front set and having two projections at two ends respectively, a screw driven through a positioning member into the threaded hole to fasten the positioning member in the transverse open groove of the front set so that the block member abuts the front pin to block same in an assembled state.

Abstract: Methods of forming a T-shaped SBD using a single-mask process flow are disclosed. Embodiments include providing a substrate having STI regions; forming a hard mask layer over the substrate and the STI regions, the hard mask having an opening laterally separated from the STI regions; forming a recess in the substrate through the opening, the recess having a first width; forming spacers on sidewalls of the recess, with a gap therebetween; forming a trench in the substrate through the gap, the trench having a second width less than the first; removing the spacers; removing the hard mask layer; filling the trench and the recess with an oxide layer, forming a T-shaped STI region; forming another hard mask layer on a portion of the T-shaped STI region; and revealing a Fin by removing portions of the STI regions and the T-shaped STI region.

Abstract: A mask for use in fabricating one or more semiconductor devices is fabricated by: providing sacrificial spacing structures disposed over a substrate structure, and including protective hard masks at upper surfaces of the spacing structures; disposing a sidewall spacer layer conformally over the sacrificial spacing structures; selectively removing the sidewall spacer layer from above the sacrificial spacing structures to expose the protective hard masks of the spacing structures, the selectively removing including leaving sidewall spacers along sidewalls of the sacrificial spacing structures; providing a protective material over the substrate structure; and removing the exposed protective hard masks from the sacrificial spacing structures, and thereafter, removing remaining sacrificial spacing structures and the protective material, leaving the sidewall spacers over the substrate structure as a mask.

Abstract: The present invention is directed to a method and apparatus for etching various metals that may be used in semiconductor or integrated circuit processing through the use of non-halogen gases such as hydrogen, helium, or combinations of hydrogen and helium with other gases such as argon. In one exemplary embodiment of the present invention, in a reaction chamber, a substrate having a metal interconnect layer deposited thereon is exposed to a plasma formed of non-halogen gas. The plasma generated is maintained for a certain period of time to provide for a desired or expected etching of the metal. In some embodiments, the metal interconnect layer may be copper, gold or silver.

Abstract: The present invention is directed to a method and apparatus for etching various metals that may be used in semiconductor or integrated circuit processing through the use of non-halogen gases such as hydrogen, helium, or combinations of hydrogen and helium with other gases such as argon. In one exemplary embodiment of the present invention, in a reaction chamber, a substrate having a metal interconnect layer deposited thereon is exposed to a plasma formed of non-halogen gas. The plasma generated is maintained for a certain period of time to provide for a desired or expected etching of the metal. In some embodiments, the metal interconnect layer may be copper, gold or silver.