Abstract: A power module includes a first substrate, a second substrate, a chip, and a package body. The first substrate includes a first surface and a second surface, and the first surface is configured to mount the chip. The second substrate includes a bearing surface, the bearing surface is configured to bear the first substrate, and the bearing surface is in contact with the second surface. The bearing surface includes a first region and a second region, the first region is opposite to the first substrate, the second region is disposed in a ring shape around the first region, and a surface material of the second region includes copper, a copper alloy, or a copper oxide. The package body is configured to wrap the chip, the first substrate, and at least a part of the second substrate, and the package body is in contact with the second region.

Abstract: A power module includes a heat dissipation panel, a substrate, and a chip that are sequentially stacked. A first region and a second region are disposed on a surface of the heat dissipation panel, the second region is disposed at least at a corner of the first region, and surface roughness of the second region is greater than surface roughness of the first region. A projection of the substrate in a thickness direction of the heat dissipation panel overlaps the first region. A third region is disposed on a surface that is of the substrate and that is away from the heat dissipation panel, and a projection of the chip in the thickness direction of the heat dissipation panel overlaps the third region. The substrate and the chip are packaged using a molding compound, and the second region is in contact with the molding compound.

Abstract: The technology of this application relates to a semiconductor packaged structure, including a circuit board, a chip, a pin, and a plastic package body. The pin includes a connecting part and a pressfit, one end of the connecting part is welded to the circuit board, the other end is flush with a top surface of the plastic package body, the connecting part has a mounting hole, the pressfit is disposed in the mounting hole and is in an interference fit with the connecting part, the pressfit is exposed from the top surface of the plastic package body. Alternatively, the pin includes a pressfit, the plastic package body is provided with a mounting hole that runs through a plastic package body, the pressfit is provided in the mounting hole, one end of the pressfit is welded to the circuit board, the other end is exposed from the top surface of the plastic package body.

Abstract: An injection mold and an injection molding method are provided. The injection mold includes a housing and a cover. The housing is provided with a mold cavity. The mold cavity is configured to accommodate a power module. The cover is provided with a plurality of vias. The cover is detachably connected to the housing. The cover is located in the mold cavity and locates the power module jointly with the housing. The plurality of vias are configured to match a plurality of pins of the power module. In this application, the cover is disposed, and the cover is provided with the vias for pins to pass through. By using covers with different arrangement manners of vias, a same set of injection molds can be compatible with power modules of a same series that have different locations of pins. Arrangement manners of vias on different covers are different.

Abstract: A power module is provided. The power module includes a substrate, and the substrate is used to carry components and pins of the power module. A circuit layer is disposed on the substrate, to complete an electrical connection between the carried components. The components and the pins are disposed on a same surface of the substrate, and the components and the pins are electrically connected by using the substrate. The power module further includes a sealing layer. The sealing layer is sleeved on the pins, the pins are partially exposed on a surface that is of the sealing layer and that faces away from a plastic packaging layer, and a space for accommodating the plastic packaging layer is formed between the sealing layer and the substrate.