Abstract: A method for construction of an A/B switch is accomplished by press fitting two components of the switch together. The first component includes a circuit board with the switch circuitry. The circuit board is surrounded by an inner housing. An outer housing provides the output terminals for connecting the switch to other equipment. The outer housing has protrusions formed thereon for engaging and securing the inner housing when the inner and outer housings are press fit together.

Abstract: A PC board for mating with a card-edge connector having a selectively configured projecting tab which defines a desired insertion force profile to facilitate engagement. A portion of the projecting tab is notched to delay the initial contact from the internal spring contacts of the mating card-edge connector until a proportional amount of contacts have opened and wiped some of the PC board terminals first, and then to allow the remaining contacts to engage the notched portion. Initial insertion force is relieved in proportion to the PC board edge profile.

Abstract: A tape transport which is sized to fit within an 8 inch form factor or footprint, to accommodate prevailing mini/micro computer applications, and including operative components which are capable of automatically receiving IBM Corporation's 3480-type tape cartridge and the web of tape which it contains for appropriate introduction to the transport for presentation to a high performance magnetic recording head. This permits a use of the 3480 tape cartridge in a transport apparatus which is capable of fitting within an 8 inch form factor or footprint, and which is therfore acceptable for use in connection with many mini/micro computer applications, yet which is capable of providing high performance (parallel track, high transfer rate) storage and retrieval due to its compatability (and interchangeability) with the format used by the IBM Corporation in connection with its 3480 tape cartridge.

Abstract: The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible microbellows. The surface area of the heat spreader is greater than the mating surface area of the chip. The heat spreader is attached to the bottom surface of the microbellows. The surface area of the heat spreader which mates with the surface of the chip is highly polished and coated with a highly conductive soft metal. A jet of coolant is forced into the inner surface of the microbellows.

Abstract: An integrated circuit chip is cooled by being mounted on a substrate which is urged into contact with a compliant mat which includes a layer having a predetermined array of interconnected metallic pads for spreading heat flux more uniformly. The mat is connected to a plate which may be water cooled. The mat also includes additional layers which are heat conductive and electrically insulative. One of the additional layers is a film of paste.

Abstract: An oscillating coolant pump includes a pair of opposed bellows mounted to reciprocate in a housing for moving a volume of fluid through a heat exchanger and an electronics package. The pump functions without the use of check valves.

Abstract: A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bunches of heat conducting strands extend into the first cooling portion so that each bunch is urged into deflecting contact with a respective chip. A fluid inlet and outlet are provided in the second cooling portion.

Abstract: A multichip thermal conduction module has improved cooling in a housing having at least one board mounted therein including a plurality of chips on the board. A heat conducting plate is mounted in the housing adjacent the chips. A cold plate abuts heat conducting plate and includes an inlet an outlet connected to a coolant passage formed therein for guiding a coolant through the housing. Flexible heat conductors are connected to the heat conducting plate and are urged into aligned contact with the chips for conducting heat therefrom. The flexible conductors are in fluid communication with the cold plate passage for conducting coolant adjacent the chips.

Abstract: Apparatus is disclosed for positioning a continuous paper form having uniformly positioned seams and emanating from a high speed printing device, such as from a high-speed computer printer, in a bin or stacker. Air jets positioned on the stacker are utilized in a mode whereby air bursts from the jets impinge at discrete locations on a top surface of the form as it emanates from the printer. The air bursts cause the continuous paper form to fold naturally in a stacker bin at the paper seams.

Abstract: A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bellows extend into the first cooling portion so that each bellows is urged into deflecting contact with a respective chip. A plurality of heat conducting strands are mounted in each bellows and extend into the second cooling portion. A fluid coolant is directed to flow across the heat conducting strands.

Abstract: There is disclosed a closely arranged file of flexible rotating disk memory elements in which a disk may be randomly accessed with minimum error and relatively rapid access time. This disk system utilizes different diameter disks which are arranged in an ascending order in a sub-stack, are rotated at a relatively slow speed. A plurality of the sub-stacks, wherein there is a correspondence between the same diameter disk of each stack, are utilized to provide for a large memory capacity. Microprocessing techniques are utilized for sub-stack and disk selection.

Abstract: There is disclosed a low-cost, axial fluid pump which does not involve the conversion of rotary to linear motion. The fluid pump herein is based on the principle of successively using a ball, that may be obtained from a reservoir of similar balls, as a piston within an enclosed cylinder. The ball is made to traverse the cylinder's length by simple non-motor means, thereby compressing the fluid. Upon pressurizing the fluid, the ball eventually returns to the reservoir and a new ball from the reservoir repeats the compression cycle. The pump of this invention is adapted for low pressure, low rate of flow, and low cost applications.