Patents by Inventor Fardad Chamran

Fardad Chamran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8808256
    Abstract: A punctal plug or lacrimal insert comprising a microelectromechanical system pump and associated reservoir may be utilized to deliver precise dosages of an active agent into the eye though the tear film. The microelectromechanical system pump comprises four main components; namely, a reservoir, a pump, a series of valves and a vent. The microelectromechanical system pump is positioned within a cavity in the punctal plug. The microelectromechanical system pump is positioned with a cavity in the punctal plug.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: August 19, 2014
    Assignee: Johnson & Johnson Vision Care, Inc.
    Inventors: Stephen R. Beaton, Michael Ferran, Justin Scott Jacobs, Jason M. Tokarski, Christopher S. Gudeman, Fardad Chamran, Paul J. Rubel, Bret A. Coldren
  • Publication number: 20130184661
    Abstract: A punctal plug or lacrimal insert comprising a microelectromechanical system pump and associated reservoir may be utilized to deliver precise dosages of an active agent into the eye though the tear film. The microelectromechanical system pump comprises four main components; namely, a reservoir, a pump, a series of valves and a vent. The microelectromechanical system pump is positioned within a cavity in the punctal plug. The microelectromechanical system pump is positioned with a cavity in the punctal plug.
    Type: Application
    Filed: January 16, 2012
    Publication date: July 18, 2013
    Inventors: Stephen R. Beaton, Michael Ferran, Justin Scott Jacobs, Jason M. Tokarski, Christopher S. Gudeman, Fardad Chamran, Paul J. Rubel, Bret A. Coldren
  • Publication number: 20060273065
    Abstract: A method of forming free standing microstructures includes providing a substrate and forming a sacrificial layer on the substrate. A thin-film structural layer is then formed around and over the sacrificial layer. The sacrificial layer may be formed from an electrically conductive or non-electrically conductive material in certain embodiments of the invention. Nanometer-scale pores are then introduced through the thin-film structural layer by a non-lithographic method, such as anodic etching. Via the pores, at least a portion of the sacrificial layer is etched away or otherwise removed from underneath the thin-film structural layer. The free standing microstructures may be sealed by application of a sealing layer on top thereof. The microstructure may form an encapsulating cavity and provide integrated on-wafer packaging if separate microdevices are disposed inside the cavity. The entire process may be done at or near room temperature in some cases.
    Type: Application
    Filed: June 1, 2006
    Publication date: December 7, 2006
    Applicant: The Regents of the University of California
    Inventors: Chang-Jin Kim, Rihui He, Fardad Chamran