Abstract: A method and apparatus are provided for migrating one or more hardware devices (105) associated with a virtual machine (103) from a source machine (101) to a destination machine (111) by capturing, formatting, storing, and transferring hardware context information from the hardware device(s) at the source machine during the virtual machine migration process using a defined handshake protocol at each associated hardware driver (105) to capture the hardware context information from an associated hardware device (105) being migrated.

Abstract: A method and apparatus are provided for migrating one or more hardware devices (105) associated with a virtual machine (103) from a source machine (101) to a destination machine (111) by capturing, formatting, storing, and transferring hardware context information from the hardware device(s) at the source machine during the virtual machine migration process using a defined handshake protocol at each associated hardware driver (105) to capture the hardware context information from an associated hardware device (105) being migrated.

Abstract: Embodiments of the invention contemplate the formation of a solar cell module comprising an array of interconnected solar cells that are formed using an automated processing sequence that is used to form a novel solar cell interconnect structure. In one embodiment, the module structure described herein includes a patterned adhesive layer that is disposed on a backsheet to receive and bond a plurality of patterned conducting ribbons thereon. The bonded conducting ribbons are then used to interconnect an array of solar cell devices to form a solar cell module that can be electrically connected to external components that can receive the solar cell module's generated electricity.

Abstract: The present invention generally relates to low-concentration photovoltaic modules. The photovoltaic modules may comprise a flexible backsheet having a plurality of electrically conductive circuit elements that have been embossed or imprinted to create optical features in the electrically conductive surface. The solar cells are then in electrical contact with the electrically conductive circuit elements to complete the photovoltaic module. By imprinting/embossing the electrically conductive circuit elements, incident solar radiation that would normally not reach the solar cells may be reflected and collected by the solar cells. Thus, substantially all of the solar radiation that is exposed to the photovoltaic module is collected by the solar cells of the photovoltaic module.

Abstract: Embodiments of the invention contemplate the formation of a solar cell module comprising an array of interconnected solar cells that are formed using an automated processing sequence that is used to form a novel planar solar cell interconnect structure. In one embodiment, the module structure described herein includes a patterned adhesive layer that is disposed on a backsheet to receive and bond a plurality of conducting ribbons thereon. The substantially planar bonded conducting ribbons are then used to interconnect an array of solar cell devices to form a solar cell module that can be electrically connected to one or more external components, such as an electrical power grid, satellites, electronic devices or other similar power requiring units. Embodiments of the invention may further provide a roll-to-roll system that is configured to serially form a plurality of solar cell modules over different portions of a backsheet material received from a roll of backsheet material.

Abstract: Embodiments of the invention contemplate the formation of a solar cell module comprising an array of interconnected solar cells that are formed using an automated processing sequence that is used to form a novel solar cell interconnect structure. In one embodiment, the module structure described herein includes a patterned adhesive layer that is disposed on a backsheet to receive and bond a plurality of patterned conducting ribbons thereon. The bonded conducting ribbons are then used to interconnect an array of solar cell devices to form a solar cell module that can be electrically connected to external components that can receive the solar cell module's generated electricity.

Abstract: The present invention generally relates to low-concentration photovoltaic modules. The photovoltaic modules may comprise a flexible backsheet having a plurality of electrically conductive circuit elements that have been embossed or imprinted to create optical features in the electrically conductive surface. The solar cells are then in electrical contact with the electrically conductive circuit elements to complete the photovoltaic module. By imprinting/embossing the electrically conductive circuit elements, incident solar radiation that would normally not reach the solar cells may be reflected and collected by the solar cells. Thus, substantially all of the solar radiation that is exposed to the photovoltaic module is collected by the solar cells of the photovoltaic module.

Abstract: The present invention comprises methods for manufacturing solar cell modules having improved fault tolerance and the ability to maximize module power output in response to non-optimal operation of one or more solar cells in the module. To improve the fault tolerance, the individual solar cells may each have a bypass diode coupled thereto to that when a single solar cell faults, only the faulted solar cell is affected. In one embodiment, a transistor may be used to improve the fault tolerance of a solar cell module.