Abstract: A modular wire processing center comprises a plurality of individual processing modules that are controlled by a central control unit. The plurality of processing modules includes an automatic crimper and at least two further processing modules selected from the group of an automatic cutter, a marking system, a stripping unit, a terminal feeding device, a wire feeding unit and a wire discharging/bundling unit. The processing modules are designed as independently operable individual processing units and are positioned with the control unit on a mobile platform.

Abstract: A method and device are provided for marking electrical devices which can be arranged in a row on a support rail, with the aid of a laser head, wherein the support rail is pivotable about its longitudinal axis and the laser head is guided such that it can be moved at least along the longitudinal axis of the support rail. A number of marking instructions, each including a marking content and a position and an orientation of the surface to which the marking content is to be applied are specified. An image of at least a section of the support rail and of at least one electrical device are created from an image capture device and at least one of the positions at which one of the marking contents is to be applied is corrected based on an evaluation of the image. The marking instructions are grouped into marking levels in such a way that all marking instructions of one marking level can be applied by the laser head without a movement of the laser head or the support rail.

Abstract: A method and device are provided for marking electrical devices which can be arranged in a row on a support rail, with the aid of a laser head, wherein the support rail is pivotable about its longitudinal axis and the laser head is guided such that it can be moved at least along the longitudinal axis of the support rail. A number of marking instructions, each including a marking content and a position and an orientation of the surface to which the marking content is to be applied are specified. An image of at least a section of the support rail and of at least one electrical device are created from an image capture device and at least one of the positions at which one of the marking contents is to be applied is corrected based on an evaluation of the image. The marking instructions are grouped into marking levels in such a way that all marking instructions of one marking level can be applied by the laser head without a movement of the laser head or the support rail.

Abstract: A modular wire processing center comprises a plurality of individual processing modules that are controlled by a central control unit. The plurality of processing modules includes an automatic crimper and at least two further processing modules selected from the group of an automatic cutter, a marking system, a stripping unit, a terminal feeding device, a wire feeding unit and a wire discharging/bundling unit. The processing modules are designed as independently operable individual processing units and are positioned with the control unit on a mobile platform.