Patents by Inventor Farncis Carney

Farncis Carney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE STRUCTURE FOR VERTICAL MOUNT AND METHOD
    Publication number: 20080111227
    Abstract: In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.
    Type: Application
    Filed: January 22, 2008
    Publication date: May 15, 2008
    Inventors: Stephen St. Germain, Farncis Carney, Bruce Huling