Patents by Inventor Farrah J. Johnson

Farrah J. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of coating contacts on a surface of a flip chip
    Patent number: 7578056
    Abstract: A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) so that the coating is at least partially cured.
    Type: Grant
    Filed: December 18, 2006
    Date of Patent: August 25, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Farrah J. Johnson, Tongbi Jiang
  • Flip chip dip coating encapsulant
    Patent number: 7150390
    Abstract: A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) to surface cure a skin over the polymer coating. The skin-cured flip chip is placed on a substrate which is then heated to reflow the conductive material from the projections and to cause the polymer from the coating to underfill the flip chip and thermally cure to encapsulate and underfill the flip chip.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: December 19, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Farrah J. Johnson, Tongbi Jiang
  • Flip chip dip coating encapsulant
    Patent number: 6551863
    Abstract: A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) to surface cure a skin over the polymer coating. The skin-cured flip chip is placed on a substrate which is then heated to reflow the conductive material from the projections and to cause the polymer from the coating to underfill the flip chip and thermally cure to encapsulate and underfill the flip chip.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: April 22, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Farrah J. Johnson, Tongbi Jiang
  • Flip chip dip coating encapsulant
    Publication number: 20030062400
    Abstract: A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) to surface cure a skin over the polymer coating. The skin-cured flip chip is placed on a substrate which is then heated to reflow the conductive material from the projections and to cause the polymer from the coating to underfill the flip chip and thermally cure to encapsulate and underfill the flip chip.
    Type: Application
    Filed: November 18, 2002
    Publication date: April 3, 2003
    Inventors: Farrah J. Johnson, Tongbi Jiang
  • FLIP CHIP DIP COATING ENCAPSULANT
    Publication number: 20030045027
    Abstract: A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) to surface cure a skin over the polymer coating. The skin-cured flip chip is placed on a substrate which is then heated to reflow the conductive material from the projections and to cause the polymer from the coating to underfill the flip chip and thermally cure to encapsulate and underfill the flip chip.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 6, 2003
    Inventors: Farrah J. Johnson, Tongbi Jiang
  • Method of using thin-clad near infrared transparent optical glass fibers as evanescent wave sensors
    Patent number: 6198861
    Abstract: A method of analyzing a chemical reaction in a material including the steps of embedding in a material an optical fiber having a cladding along substantially the entire length thereof that is in contact with the material, transmitting light through the optical fiber, and performing evanescent wave spectroscopy on the light transmitted through the optical fiber. The optical fiber preferably has a core 10-30 &mgr;m in diameter and a cladding that is on the order of 1 &mgr;m thick.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: March 6, 2001
    Assignee: South Dakota School of Mines and Technology
    Inventors: Jon J. Kellar, William M. Cross, Farrah J. Johnson, Michael E. Connell