Patents by Inventor Farrah Johnson

Farrah Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip dip coating encapsulant
    Publication number: 20070102491
    Abstract: A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) so that the coating is at least partially cured.
    Type: Application
    Filed: December 18, 2006
    Publication date: May 10, 2007
    Applicant: Micron Technology, Inc.
    Inventors: Farrah Johnson, Tongbi Jiang