Patents by Inventor Farzad Houshmand

Farzad Houshmand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210166923
    Abstract: Plasma source assemblies comprising an RF hot electrode having a body and at least one return electrode spaced from the RF hot electrode to provide a gap in which a plasma can be formed. An RF feed is connected to the RF hot electrode at a distance from the inner peripheral end of the RF hot electrode that is less than or equal to about 25% of the length of the RF hot electrode.
    Type: Application
    Filed: January 15, 2021
    Publication date: June 3, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Kallol Bera, Anantha K. Subramani, John C. Forster, Philip A. Kraus, Farzad Houshmand, Hanhong Chen
  • Patent number: 10903056
    Abstract: Plasma source assemblies comprising an RF hot electrode having a body and at least one return electrode spaced from the RF hot electrode to provide a gap in which a plasma can be formed. An RF feed is connected to the RF hot electrode at a distance from the inner peripheral end of the RF hot electrode that is less than or equal to about 25% of the length of the RF hot electrode.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: January 26, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Kallol Bera, Anantha K. Subramani, John C. Forster, Philip A. Kraus, Farzad Houshmand, Hanhong Chen
  • Publication number: 20210020484
    Abstract: Methods and apparatus for a PVD chamber are provided herein. In some embodiments, a selective PVD chamber includes a first housing surrounding a movable substrate support; a second housing adjacent the first housing; an opening disposed between the first housing and the second housing that partially exposes a top surface of the movable substrate support, wherein the opening includes a first curved side; and an elongate target disposed in the second housing to provide a stream of material flux from the elongate target into the first housing via the opening.
    Type: Application
    Filed: June 26, 2020
    Publication date: January 21, 2021
    Inventors: Keith Miller, Farzad HOUSHMAND, Prasoon SHUKLA
  • Patent number: 10879042
    Abstract: Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: December 29, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Anantha K. Subramani, Farzad Houshmand, Philip A. Kraus, Abhishek Chowdhury, John C. Forster, Kallol Bera
  • Publication number: 20200402769
    Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.
    Type: Application
    Filed: July 6, 2020
    Publication date: December 24, 2020
    Inventors: Thai Cheng Chua, Farzad Houshmand, Christian Amormino, Philip Allan Kraus
  • Patent number: 10707058
    Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: July 7, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Thai Cheng Chua, Farzad Houshmand, Christian Amormino, Philip Allan Kraus
  • Publication number: 20200051794
    Abstract: Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 13, 2020
    Inventors: ANANTHA K. SUBRAMANI, PRABURAM RAJA, STEVEN V. SANSONI, JOHN FORSTER, PHILIP KRAUS, YANG GUO, PRASHANTH KOTHNUR, FARZAD HOUSHMAND, BENCHERKI MEBARKI, JOHN JOSEPH MAZZOCCO, THOMAS BREZOCZKY
  • Publication number: 20190353919
    Abstract: Multi-zone collimators and process chambers including multi-zone collimators for use with a multi-zone magnetron source are provided herein. In some embodiments, a multi-zone collimator for use with a multi-zone magnetron source, comprising a first collimator plate, a second collimator plate, wherein a first collimator zone having a first width is formed between the first collimator plate and the second collimator plate; and a third collimator plate, wherein a second collimator zone having a second width is formed between the second first collimator plate and the third collimator plate, wherein a length of each of the first, second and third collimator plates are different from each other.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 21, 2019
    Inventors: BENCHERKI MEBARKI, JOUNG JOO LEE, FARZAD HOUSHMAND, ANANTHA SUBRAMANI, KEITH MILLER, XIANMIN TANG, PRASHANTH KOTHNUR
  • Publication number: 20190276931
    Abstract: Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, an apparatus for physical vapor deposition (PVD) includes: a linear PVD source to provide a stream of material flux comprising material to be deposited on a substrate; and a substrate support having a support surface to support the substrate at a non-perpendicular angle to the linear PVD source, wherein the substrate support and linear PVD source are movable with respect to each other along an axis that is perpendicular to a plane of the support surface of the substrate support sufficiently to cause the stream of material flux to move over a working surface of the substrate disposed on the substrate support during operation.
    Type: Application
    Filed: March 8, 2019
    Publication date: September 12, 2019
    Inventors: Bencherki Mebarki, Anantha K. Subramani, Joung Joo Lee, Farzad Houshmand, Kelvin Chan, Kenneth Starks, Xianmin Tang
  • Publication number: 20180330927
    Abstract: Plasma source assemblies comprising an RF hot electrode having a body and at least one return electrode spaced from the RF hot electrode to provide a gap in which a plasma can be formed. An RF feed is connected to the RF hot electrode at a distance from the inner peripheral end of the RF hot electrode that is less than or equal to about 25% of the length of the RF hot electrode.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 15, 2018
    Inventors: Kallol Bera, Anantha K. Subramani, John C. Forster, Philip A. Kraus, Farzad Houshmand, Hanhong Chen
  • Patent number: 10121655
    Abstract: Plasma source assemblies comprising a housing with an RF hot electrode and a return electrode are described. The housing includes a gas inlet and a front face defining a flow path. The RF hot electrode includes a first surface oriented substantially parallel to the flow path. The return electrode includes a first surface oriented substantially parallel to the flow path and spaced from the first surface of the RF hot electrode to form a gap. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: November 6, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Anantha K. Subramani, Kaushal Gangakhedkar, Abhishek Chowdhury, John C. Forster, Nattaworn Nuntaworanuch, Kallol Bera, Philip A. Kraus, Farzad Houshmand
  • Publication number: 20180294143
    Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.
    Type: Application
    Filed: April 11, 2017
    Publication date: October 11, 2018
    Inventors: Thai Cheng Chua, Farzad Houshmand, Christian Amormino, Philip Allan Kraus
  • Publication number: 20170213701
    Abstract: Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot electrode toward the opening in a front face of the housing are described. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.
    Type: Application
    Filed: January 24, 2017
    Publication date: July 27, 2017
    Inventors: Anantha K. Subramani, Farzad Houshmand, Philip A. Kraus, Abhishek Chowdhury, John C. Forster, Kallol Bera
  • Publication number: 20170148626
    Abstract: Plasma source assemblies comprising a housing with an RF hot electrode and a return electrode are described. The housing includes a gas inlet and a front face defining a flow path. The RF hot electrode includes a first surface oriented substantially parallel to the flow path. The return electrode includes a first surface oriented substantially parallel to the flow path and spaced from the first surface of the RF hot electrode to form a gap. Processing chambers incorporating the plasma source assemblies and methods of using the plasma source assemblies are also described.
    Type: Application
    Filed: November 16, 2016
    Publication date: May 25, 2017
    Inventors: Anantha K. Subramani, Kaushal Gangakhedkar, Abhishek Chowdhury, John C. Forster, Nattaworn Nuntaworanuch, Kallol Bera, Philip A. Kraus, Farzad Houshmand