Patents by Inventor Farzana Hussain

Farzana Hussain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Veneer panel with thin thermally conductive layer
    Patent number: 11014330
    Abstract: A veneer panel may comprise a face veneer, a thermally conductive layer, and a backing layer bonded to the thermally conductive layer. The thermally conductive layer may comprise a chemically treated thermally conductive layer. The chemically treated thermally conductive layer may comprise a plurality of first vinyl groups chemically bonded to a first surface of the chemically treated thermally conductive layer.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: May 25, 2021
    Assignee: Goodrich Corporation
    Inventors: Zhongfen Ding, Scott Alan Eastman, Michael Paul Humbert, Steven W. Gronda, Jacquelynn K M Garofano, Brian St. Rock, Christopher L. Chapman, Farzana Hussain
  • Flexible polyimide-backed aviation veneer
    Patent number: 10821710
    Abstract: A veneer assembly comprises a face veneer comprising at least one of a wood or a wood composite, and a polyimide backing-layer bonded to the face veneer. The veneer assembly may include an adhesive material boding the face veneer and the polyimide backing-layer. The veneer assembly may be mounted to a substrate to form an aviation veneer panel.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: November 3, 2020
    Assignee: GOODRICH CORPORATION
    Inventors: Farzana Hussain, Christopher L. Chapman
  • Heat resistant systems and methods
    Patent number: 10744355
    Abstract: A veneer panel may comprise an outer surface, and a heat resistant system coupled to the outer surface comprising at least one of a thermal barrier layer or an intumescent layer.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: August 18, 2020
    Assignee: GOODRICH CORPORATION
    Inventors: Scott Alan Eastman, Michael Paul Humbert, Steven W. Gronda, Zhongfen Ding, Christopher L. Chapman, Farzana Hussain
  • HEAT RESISTANT SYSTEMS AND METHODS
    Publication number: 20180280741
    Abstract: A veneer panel may comprise an outer surface, and a heat resistant system coupled to the outer surface comprising at least one of a thermal barrier layer or an intumescent layer.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 4, 2018
    Applicant: GOODRICH CORPORATION
    Inventors: Scott Alan Eastman, Michael Paul Humbert, Steven W. Gronda, Zhongfen Ding, Christopher L. Chapman, Farzana Hussain
  • FLEXIBLE POLYIMIDE-BACKED AVIATION VENEER
    Publication number: 20180281357
    Abstract: A veneer assembly comprises a face veneer comprising at least one of a wood or a wood composite, and a polyimide backing-layer bonded to the face veneer. The veneer assembly may include an adhesive material boding the face veneer and the polyimide backing-layer. The veneer assembly may be mounted to a substrate to form an aviation veneer panel.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 4, 2018
    Applicant: GOODRICH CORPORATION
    Inventors: Farzana Hussain, Christopher L. Chapman
  • VENEER PANEL WITH THIN THERMALLY CONDUCTIVE LAYER
    Publication number: 20180272648
    Abstract: A veneer panel may comprise a face veneer, a thermally conductive layer, and a backing layer bonded to the thermally conductive layer. The thermally conductive layer may comprise a chemically treated thermally conductive layer. The chemically treated thermally conductive layer may comprise a plurality of first vinyl groups chemically bonded to a first surface of the chemically treated thermally conductive layer.
    Type: Application
    Filed: March 24, 2017
    Publication date: September 27, 2018
    Applicant: GOODRICH CORPORATION
    Inventors: Zhongfen Ding, Scott Alan Eastman, Michael Paul Humbert, Steven W. Gronda, Jacquelynn KM Garofano, Brian St. Rock, Christopher L. Chapman, Farzana Hussain