Abstract: A multilayer package-on-package (PoP) assembly and a method for packaging a multilayer assembly are provided. The multilayer PoP assembly includes at least two circuit boards. An interposer is disposed between two adjacent circuit boards of the at least two circuit boards. A shield is disposed on an upper contact surface and/or a lower contact surface of the interposer in contact with the at least two circuit boards. Electrical elements on a corresponding contact surface are all surrounded by the shield. A height of the shield is not less than a height of each of the electrical elements.