Patents by Inventor Faye WALKER

Faye WALKER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11854879
    Abstract: A Cu3Sn electrical interconnect and method of making same in an electrical device, such as for hybrid bond 3D-integration of the electrical device with one or more other electrical devices. The method of forming the Cu3Sn electrical interconnect includes: depositing a Sn layer in the via hole; depositing a Cu layer atop and in contact with the Sn layer; and heating the Sn layer and the Cu layer such that the Sn and Cu layers diffuse together to form a Cu3Sn interconnect in the via hole. During the heating, a diffusion front between the Sn and Cu layers moves in a direction toward the Cu layer as initially deposited, such that any remaining Cu layer or any voids formed during the diffusion are at an upper region of the formed Cu3Sn interconnect in the via hole, thereby allowing such voids or remaining material to be easily removed.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: December 26, 2023
    Assignee: Raytheon Company
    Inventors: Andrew Clarke, John J. Drab, Faye Walker
  • Publication number: 20210265206
    Abstract: A Cu3Sn electrical interconnect and method of making same in an electrical device, such as for hybrid bond 3D-integration of the electrical device with one or more other electrical devices. The method of forming the Cu3Sn electrical interconnect includes: depositing a Sn layer in the via hole; depositing a Cu layer atop and in contact with the Sn layer; and heating the Sn layer and the Cu layer such that the Sn and Cu layers diffuse together to form a Cu3Sn interconnect in the via hole. During the heating, a diffusion front between the Sn and Cu layers moves in a direction toward the Cu layer as initially deposited, such that any remaining Cu layer or any voids formed during the diffusion are at an upper region of the formed Cu3Sn interconnect in the via hole, thereby allowing such voids or remaining material to be easily removed.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 26, 2021
    Inventors: Andrew Clarke, John J. Drab, Faye Walker
  • Patent number: 11007849
    Abstract: This application provides a method of using aptamers to determine the presence of HCP's in a recombinant protein preparation, and provides methods of preparing a plurality of aptamers for use in the method of detecting a plurality of HCP's in a recombinant protein preparation. In accordance with the description, a method of determining the presence or absence of a plurality of HCP's in a recombinant protein preparation comprises: providing a recombinant protein preparation; providing a final pool of aptamers; combining the recombinant protein preparation with the final pool of aptamers; and determining the presence or absence of a plurality of HCP's.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: May 18, 2021
    Assignees: Medlmmune, LLC, The Regents of the University of California
    Inventors: Andrew Csordas, James B. McGivney IV, Hyongsok Tom Soh, Robert Strouse, Faye Walker
  • Publication number: 20170274734
    Abstract: This application provides a method of using aptamers to determine the presence of HCP's in a recombinant protein preparation, and provides methods of preparing a plurality of aptamers for use in the method of detecting a plurality of HCP's in a recombinant protein preparation. In accordance with the description, a method of determining the presence or absence of a plurality of HCP's in a recombinant protein preparation comprises: providing a recombinant protein preparation; providing a final pool of aptamers; combining the recombinant protein preparation with the final pool of aptamers; and determining the presence or absence of a plurality of HCP's.
    Type: Application
    Filed: August 14, 2015
    Publication date: September 28, 2017
    Inventors: Andrew CSORDAS, James B. MCGIVENY IV, Hyongsok Tom SOH, Robert STROUSE, Faye WALKER