Patents by Inventor Federick J. Hirsekorn

Federick J. Hirsekorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4814398
    Abstract: A B stageable thermosettable composition containing at least one polyepoxide and at least one linear anhydride monomer capable of forming a cyclopolymer in situ and processes for the formation of the B stage intermediate and final thermoset having a high service temperature is provided. The composition is useful in a two stage process; first to form a storage stable, flowable thermoplastic B stage intermediate by the free radical initiated vinyl polymerization of the linear anhydride in the liquid composition to a cyclic polymer and secondly to react the cyclic polymer with the poly epoxide to form a crosslinked high service temperature thermoset useful in the preparation of laminates, such as printed circuit boards, adhesives and encapsulants.
    Type: Grant
    Filed: December 28, 1987
    Date of Patent: March 21, 1989
    Assignee: Rohm and Haas Co.
    Inventors: Federick J. Hirsekorn, William D. Emmons