Patents by Inventor Federico Fantini

Federico Fantini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic Component Having Improved Heat Resistance
    Publication number: 20240153702
    Abstract: Provided is an electronic component, and particularly a film capacitor, comprising a working element comprising a dielectric and an encasement with the working element encased in said encasement wherein the encasement comprises a phase change material.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Inventors: Marco Michelazzi, Vincenzo Emanuele Caridà, Federico Fantini, Evangelista Boni, Walter Bruno
  • Overmolded film capacitor
    Patent number: 11935699
    Abstract: Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: March 19, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Evangelista Boni, Federico Fantini, Gabriele Piccinini, Walter Bruno
  • Overmolded Film Capacitor
    Publication number: 20220328246
    Abstract: Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 13, 2022
    Inventors: Evangelista Boni, Federico Fantini, Gabriele Piccinini, Walter Bruno
  • Electronic Component Having Improved Heat Resistance
    Publication number: 20220319776
    Abstract: Provided is an electronic component, and particularly a film capacitor, comprising a working element comprising a dielectric and an encasement with the working element encased in said encasement wherein the encasement comprises a phase change material.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 6, 2022
    Inventors: Marco Michelazzi, Vincenzo Emanuele Caridà, Federico Fantini, Evangelista Boni, Walter Bruno