Patents by Inventor Federico Ziglioli

Federico Ziglioli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package substrate
    Patent number: 8411457
    Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: April 2, 2013
    Assignee: STMIcroelectronics S.r.l.
    Inventors: Federico Ziglioli, Giovanni Graziosi, Mario Cortese
  • SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES
    Publication number: 20100052144
    Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
    Type: Application
    Filed: November 10, 2009
    Publication date: March 4, 2010
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: FEDERICO ZIGLIOLI, GIOVANNI GRAZIOSI, MARIO CORTESE
  • Semiconductor package substrate and method, in particular for MEMS devices
    Patent number: 7616451
    Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: November 10, 2009
    Assignee: STMicroelectronics S.r.l.
    Inventors: Federico Ziglioli, Giovanni Graziosi, Mario Cortese
  • Semiconductor package substrate and method, in particular for MEMS devices
    Publication number: 20080087997
    Abstract: A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
    Type: Application
    Filed: October 13, 2006
    Publication date: April 17, 2008
    Inventors: Federico Ziglioli, Giovanni Graziosi, Mario Cortese