Patents by Inventor Fee Hoon Wong

Fee Hoon Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of assembling a semiconductor package
    Patent number: 8410586
    Abstract: A semiconductor package includes a semiconductor component including a circuit carrier with a plurality of inner contact pads, a semiconductor chip, and a plurality of electrical connections. An adhesion promotion layer is disposed on at least areas of the semiconductor component and a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections and the plurality of the inner contact pads. Surface regions of the semiconductor component are selectively activated.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: April 2, 2013
    Assignee: Infineon Technologies, AG
    Inventors: Edmund Riedl, Steffen Jordan, Christof Matthias Schilz, Fee Hoon Wong
  • Semiconductor Package and Method of Assembling a Semiconductor Package
    Publication number: 20090065912
    Abstract: A semiconductor package includes a semiconductor component including a circuit carrier with a plurality of inner contact pads, a semiconductor chip, and a plurality of electrical connections. An adhesion promotion layer is disposed on at least areas of the semiconductor component and a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections and the plurality of the inner contact pads. Surface regions of the semiconductor component are selectively activated.
    Type: Application
    Filed: October 7, 2008
    Publication date: March 12, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Edmund Riedl, Steffen Jordan, Christof Matthias Schilz, Fee Hoon Wong