Patents by Inventor Fei Fan

Fei Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171443
    Abstract: The present invention discloses a waveform peak clipping method and system. The waveform peak clipping method includes: 1) for a complex waveform, building two pulses by a delta function at t=0: a real pulse and an imaginary pulse; 2) performing fast Fourier transform on the two pulses and removing power at a load rate; 3) compensating for missing power and performing inverse fast Fourier transform on results; 4) convolving the pulses built in step 3) with the original waveform; and 5) iterating the convolution process until the amplitudes of the obtained waveforms at all time samples are within a limit range of a digital-to-analog converter during clipping events of all the time samples. The peak clipping method is set in the present invention to limit the amplitude of a bias waveform of a transition edge sensor in any given time sample to a maximum range of the digital-to-analog converter, without affecting the power at the carrier frequencies.
    Type: Application
    Filed: November 22, 2023
    Publication date: May 23, 2024
    Inventors: Ruirui FAN, Ran DUAN, Fei LIU, Xiaoyun MA, Di LI
  • Patent number: 11954417
    Abstract: Disclosed a method for predicting permeability of a multi-mineral phase digital core based on deep learning. In the present disclosure, a three-dimensional digital core is constructed and a pore structure is randomly generated; after a plurality of multi-mineral digital core images is acquired by performing image segmentation on the three-dimensional digital core, permeability corresponding to each of the multi-mineral digital core images is acquired by simulation using multi-physics field simulation software and a multi-mineral digital core data set is constructed based on the plurality of multi-mineral digital core images and the permeability corresponding to each of the multi-mineral digital core images; an SE-ResNet18 convolutional neural network is constructed and trained with the multi-mineral digital core data set; and an image of a multi-mineral core to be predicted is input into the trained SE-ResNet18 convolutional neural network to determine the permeability of the multi-mineral core.
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: April 9, 2024
    Assignee: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA)
    Inventors: Hai Sun, Liang Zhou, Dongyan Fan, Lei Zhang, Jun Yao, Yongfei Yang, Kai Zhang, Qian Sang, Xia Yan, Lei Liu, Fei Luo, Yuda Kan
  • Publication number: 20240106192
    Abstract: Disclosed herein are electronic devices that include arrays of dual function light transmit and receive pixels. The pixels of such arrays include a photodetector (PD) structure and a vertical-cavity, surface-emitting laser (VCSEL) diode, both formed in a common stack of epitaxial semiconductor layers. The pixels of the array may be configured by a controller or processor to function either as a light emitter by biasing the VCSEL diode, or as a light detector or receiver by a different bias applied to the PD structure, and this functionality may be altered in time. The array of dual function pixels may be positioned interior to an optical display of an electronic device, in some cases to provide depth sensing or autofocus. The array of pixels may be registered with a camera of an electronic device, such as to provide depth sensing or autofocus.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Fei Tan, Keith Lyon, Tong Chen, Chin Han Lin, Xiaofeng Fan, Arnaud Laflaquiere
  • Publication number: 20240099196
    Abstract: The disclosure provides a mower. The mower includes a vehicle frame, a walking assembly, a working assembly, a seat and a battery pack. The walking assembly includes a first walking wheel assembly and a second walking wheel assembly connected with the vehicle frame. The first walking wheel assembly and/or the second walking wheel assembly includes a main walking wheel and a hub motor, the main walking wheel is connected with the hub motor, and the hub motor is arranged outside a side of the vehicle frame. The working assembly is connected with the vehicle frame. The seat is arranged on the vehicle frame. The battery pack is lowered and mounted on the vehicle frame and extends below the seat.
    Type: Application
    Filed: December 11, 2023
    Publication date: March 28, 2024
    Applicant: Greenworks (Jiangsu) Co., Ltd.
    Inventors: Qunli WEI, Dongdong SHI, Chen ZHU, Min DING, Chaoqun WANG, Fei ZHU, Jun FAN, Liang PENG
  • Publication number: 20240096800
    Abstract: A semiconductor device includes first and second active regions extending in parallel in a substrate, a plurality of conductive patterns, each conductive pattern of the plurality of conductive patterns extending on the substrate across each of the first and second active regions, and a plurality of metal lines, each metal line of the plurality of metal lines overlying and extending across each of the first and second active regions. Each conductive pattern of the plurality of conductive patterns is electrically connected in parallel with each metal line of the plurality of metal lines.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Fei Fan DUAN, Fong-yuan CHANG, Chi-Yu LU, Po-Hsiang HUANG, Chih-Liang CHEN
  • Publication number: 20240098888
    Abstract: A circuit board assembly with a fully embedded photosensitive chip which does not require an increase in board width for the re-routing of wires around the photosensitive chip includes a circuit board and a reinforced plate at a lower elevation which is connected to the circuit board. The circuit board defines a through hole and a plurality of conductive lines. The conductive lines or the portion of them which are cut off by the location of the through hole accommodating the chip are repeated by connecting lines carried on the reinforced plate, the plurality of connecting lines connects to and continues the conductive lines which are cut off by the hole.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 21, 2024
    Inventors: HAN-RU ZHANG, KE-HUA FAN, DING-NAN HUANG, LONG-FEI ZHANG
  • Publication number: 20240089576
    Abstract: A connecting assembly comprises a substrate, a layer of conductive adhesive with conductive particles, a connection board, and a light transmission component. The connection board and the light transmission component are both glued to the substrate by the layer of conductive adhesive therebetween, and an operator can observe the a degree of deformation of the conductive particles in the layer of conductive adhesive to determine whether a conductive connection between the light transmission component and the substrate is affected. The connecting assembly allows an operator to effectively observe conductivity of every product in a nondestructive manner. A camera module comprising the connecting assembly and an electronic device are also disclosed.
    Type: Application
    Filed: November 30, 2022
    Publication date: March 14, 2024
    Inventor: FEI-FAN YU
  • Publication number: 20240079440
    Abstract: A multispectral sensing device includes a first die, including silicon, which is patterned to define a first array of sensor elements, which output first electrical signals in response to optical radiation that is incident on the device in a band of wavelengths less than 1000 nm that is incident on the front side of the first die. A second die has its first side bonded to the back side of the first die and includes a photosensitive material and is patterned to define a second array of sensor elements, which output second electrical signals in response to the optical radiation that is incident on the device in a second band of wavelengths greater than 1000 nm that passes through the first die and is incident on the first side of the second die. Readout circuitry reads the first electrical signals and the second electrical signals serially out of the device.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 7, 2024
    Inventors: Oray O. Cellek, Fei Tan, Gershon Rosenblum, Hong Wei Lee, Cheng-Ying Tsai, Jae Y. Park, Christophe Verove, John L Orlowski, Siddharth Joshi, Xiangli Li, David Coulon, Xiaofeng Fan, Keith Lyon, Nicolas Hotellier, Arnaud Laflaquière
  • Publication number: 20240034801
    Abstract: Provided are an anti-PD-L1/anti-4-1BB natural antibody structure-like heterodimeric form bispecific antibody and a preparation thereof. Specifically, provided are an anti-PD-L1/anti-4-1BB bispecific antibody that has natural IgG features, that has no mismatch between heavy and light chains and that is in the form of a highly stable heterodimer, as well as a preparation method therefor. The bispecific antibody can simultaneously bind two target molecules and is more effective in treating complex diseases and has fewer side effects.
    Type: Application
    Filed: January 7, 2022
    Publication date: February 1, 2024
    Inventors: Jiawang LIU, Yaping YANG, Siqi ZHAO, Yang LIU, Nanmeng SONG, Fei FAN, Kaixuan SU, Lanxin ZHANG, Jing WANG, Jiangcheng XU, Kyoung Woo LEE
  • Patent number: 11854973
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a first conductive pattern on a substrate, a second conductive pattern above the first conductive pattern, and a third conductive pattern above the first conductive pattern, all extending along a first direction. The first conductive pattern is electrically connected in parallel to the second conductive pattern and the third conductive pattern.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fei Fan Duan, Fong-yuan Chang, Chi-Yu Lu, Po-Hsiang Huang, Chih-Liang Chen
  • Publication number: 20230394217
    Abstract: Methods and Apparatuses for making an integrated circuit (IC) are disclosed. In accordance with some embodiments, a method including forming one or more decoupling capacitor (DCAP) cells comprising one or more polysilicon (PO) layers openings formed based on one or more photoresist layer openings formed to solve one or more design rule check (DRC) violations. The one or more DCAP cells also provide decoupling capacitors for the IC.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 7, 2023
    Inventors: Fei Fan DUAN, Li-Chun TIEN, Chih-Liang CHEN
  • Patent number: 11814674
    Abstract: Methods for the rapid amplification of extremely low quantity nucleic acids in a sample are provided. The disclosed methods are capable of amplifying less than 1 pg of DNA and/or RNA from a biological sample using a single tube and one-step or two-step preparation.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: November 14, 2023
    Assignee: The United States of America, as represented by the Secretary Department of Health and Human Services
    Inventor: Fei Fan Ng
  • Patent number: 11753601
    Abstract: A polymeric material mixture comprising a fluorine-containing polymer, a siloxane polymer, and at least two polymer processing additives (PPA), wherein the at least two polymer processing additives have different chemistries. For example, there can be a flexible coextruded pipe for providing a protective housing for cables, fluids, sludge or solids, the pipe comprising a pair of telescopically related inner and outer layers, where said inner layer is lubricated with the polymeric material mixture.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: September 12, 2023
    Assignee: Dura-Line LLC
    Inventors: H. Thomas Chung, Fei Fan, Sung Ki Cho, Sam Lukubira, Caleb Michael Spradling, Arturo Valencia
  • Publication number: 20230260985
    Abstract: A filler cell region (in a semiconductor device) includes: gate segments, a majority of first ends of which substantially align with a first reference line that parallel and proximal to a top boundary of the filler cell region, and a majority of second ends of which substantially align with a second reference line that is parallel and proximal to a bottom boundary of the filler cell region. First and second gate segments extend continuously across the filler cell region; and third & fourth and fifth & sixth gate segments are correspondingly coaxial and separated by corresponding gate-gaps. Relative to the first direction: a first end of the first gate segment extends to the top boundary of the filler cell region; and a second end of the second gate segment extends to the bottom boundary of the filler cell region.
    Type: Application
    Filed: June 17, 2022
    Publication date: August 17, 2023
    Inventors: Shun Li CHEN, Fei Fan DUAN, Ting Yu CHEN
  • Patent number: 11718872
    Abstract: A method for obtaining a single-cell mRNA sequence, including: (1) capturing mRNA of a cell by using a cell tag carrier, and performing reverse transcription to obtain cDNA having a cell tag; (2) obtaining multiple cDNA fragments having molecular tags by using a transposase complex and a molecular tag carrier; (3) performing high-throughput sequencing; (4) performing sequence assembly according to the molecular tags to obtain the sequence of each mRNA; and (5) obtaining the sequence of all mRNAs of each single cell according to the cell tags.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: August 8, 2023
    Assignee: MGI TECH CO., LTD.
    Inventors: Fei Fan, Xiaofang Cheng, Wenwei Zhang, Weimao Wang, Luman Cui, Ou Wang
  • Patent number: 11702612
    Abstract: A polymeric material mixture comprising a fluorine-containing polymer, a siloxane polymer, and at least two polymer processing additives (PPA), wherein the at least two polymer processing additives have different chemistries. For example, there can be a flexible coextruded pipe for providing a protective housing for cables, fluids, sludge or solids, the pipe comprising a pair of telescopically related inner and outer layers, where said inner layer is lubricated with the polymeric material mixture.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: July 18, 2023
    Assignee: Dura-Line LLC
    Inventors: H. Thomas Chung, Fei Fan, Sung Ki Cho, Sam Lukubira, Caleb Michael Spradling, Arturo Valencia
  • Patent number: 11657216
    Abstract: Aspects of the present disclosure relate to input text management. Input text can be received from a user. A set of key elements can be extracted from the input text. A determination can be made whether the user is mapped to an existing cluster. In response to determining that the user is mapped to an existing cluster, a structured table mapping key elements to text modifications can be referenced. The input text can be modified according to the structured table mapping key elements to text modifications, wherein the existing cluster is associated with a text modification scheme within the structured table, wherein the text modification scheme includes a first mapping of key elements to text modifications.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: May 23, 2023
    Assignee: International Business Machines Corporation
    Inventors: Fei Fan, Lin Yan Wu, Xue Ying Zhang, Jing Xu, Yan Yan Han, Yun Bo Zhang, Tao Wen
  • Publication number: 20230123108
    Abstract: A hot-pressing member proofed against thinning and shearing forces caused by laterally overflowing during pressing operations includes a base with cavity, a first supporting member in the cavity, a buffer member, and a second supporting member. The first supporting member includes first through hole. The buffer member includes a second through hole. The second supporting member is mounted on the buffer member. The second supporting member with third through hole supports the workpiece. The workpiece or part is in the third, second, and first through holes, and is hot-pressed with the adhesive film in a centered and constrained manner through all the through holes. The disclosure also provides a hot-pressing device having the hot-pressing member.
    Type: Application
    Filed: March 25, 2022
    Publication date: April 20, 2023
    Inventor: FEI-FAN YU
  • Publication number: 20230000111
    Abstract: This invention discloses method for feeding Hermetia illucens and used as for preparing composite material of puparium, which comprises the following steps: S1, dry Hermetia illucens pupariums and grind them into powdery, S2, adding powdery of Hermetia illucens pupariums into sodium hydroxide aqueous solution, stirring, separating and filtering, S3, adding the pupariums into hydrochloric acid solution, stirring, separating and filtering; S4, placing the pupariums into sodium hydroxide aqueous solution, stirring, separating and filtering; S5, drying the pupariums, and screening out the granular pretreated powder of the Hermetia illucens pupariums. The invention also disclose preparation method of composite material and thin film of Hermetia illucens pupariums and antibacterial and antimildew additive.
    Type: Application
    Filed: November 13, 2020
    Publication date: January 5, 2023
    Inventors: Chi-Hui Tsou, Manuel Reyes De Guzman, Pranut Potiyaraj, Xuemei Zhang, Ya-Li Sun, Chen Gao, Xuefei Hu, Fei-Fan Ge, Juan Du, Chunyan Zeng, Tao Yang, Ya-Ling Lee, Chih-Yuan Tsou, Jian Chen, Zhijun Chen, Shuai Yuan, Yi-Hua Wen, Chin-San Wu
  • Publication number: 20220385792
    Abstract: A lens module includes a holder, at least one lens, a base, a sensor, an anisotropic conductive film, a flexible circuit board, and a filling member. The filling member is arranged at a side of the sensor and received in the holder. Along a direction of an optical axis of the lens module, a distance between the side of the sensor and the anisotropic conductive film is defined as a first value, a thickness of the filling member is defined as a second value, a ratio of the second value to the first value is in a range of 0.8 to 1. An electronic device having the lens module is also provided.
    Type: Application
    Filed: November 24, 2021
    Publication date: December 1, 2022
    Inventor: FEI-FAN YU