Patents by Inventor Fei Hong Li

Fei Hong Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Miniature surface mount device with large pin pads
    Patent number: 9685592
    Abstract: One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: June 20, 2017
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, Yue Kwong Lau, Jun Zhang, David Todd Emerson
  • Miniature surface mount device
    Patent number: 9634209
    Abstract: A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: April 25, 2017
    Assignee: Cree, Inc.
    Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, David Todd Emerson
  • Water resistant LED devices and an LED display including same
    Patent number: 9054257
    Abstract: The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding the first plastic portion and exposing the mounting surface and the lower surface of the first plastic portion. In other embodiments, the first plastic portion includes at least one of a hole or a protrusion and the second portion includes corresponding structure filing the hole or surrounding the protrusion of the first plastic portion. The first plastic portion and the second portion have different optical properties.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: June 9, 2015
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Chi Keung Chan, Chak Hau Pang, Fei Fei Ruan, Fei Hong Li
  • Miniature Surface Mount Device
    Publication number: 20130341656
    Abstract: A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts.
    Type: Application
    Filed: August 28, 2013
    Publication date: December 26, 2013
    Applicant: Cree, Inc.
    Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, David Todd Emerson
  • MINIATURE SURFACE MOUNT DEVICE WITH LARGE PIN PADS
    Publication number: 20120104427
    Abstract: One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.
    Type: Application
    Filed: June 6, 2011
    Publication date: May 3, 2012
    Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, Yue Kwong Lau, Jun Zhang, David Todd Emerson
  • Miniature surface mount device
    Patent number: D684545
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: June 18, 2013
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, David Todd Emerson
  • Miniature surface mount device
    Patent number: D691100
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: October 8, 2013
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Chi Keung Chan, Chak Hau Pang, Fei Hong Li, Yue Kwong Lau, Jun Zhang, David Todd Emerson