Abstract: In a bonding process of a flip chip bonding method, a chip is bonded to contact pads of a substrate by composite bumps which each includes a raiser, a UBM layer and a bonding layer. Before the bonding process, the surface of the bonding layer facing toward the substrate is referred to as a surface to be bonded. During the bonding process, the surface to be bonded is boned to the contact pad and become a bonding surface on the contact pad. The bonding surface has an area greater than that of the surface to be bonded so as to reduce electrical impedance between the chip and the substrate.

Abstract: A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.

Abstract: A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.

Abstract: A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.

Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.

Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.

Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.

Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.

Abstract: A manufacturing method of a substrate with a bump structure, a copper layer is formed on a semiconductor substrate, and a nickel layer is formed on the copper layer. A bump structure is composed of the copper layer and the nickel layer, wherein the hardness of the bump structure after annealing process depends on the thickness of the nickel layer to meet the user's demand. The hardness of the bump structure meets the user's demand prevents a glass substrate from cracking when the substrate with the bump structure is bonded with the glass substrate.

Abstract: A semiconductor package process includes the following steps, providing a first substrate having a first metal bump, the first metal bump comprises a joint portion having a first softening point; providing a second substrate having a second metal bump having a top surface, a lateral surface and a second softening point, wherein the first softening point is smaller than the second softening point; performing a heating procedure to make the joint portion of the first metal bump become a softened state; and laminating the first substrate on the second substrate to make the second metal bump embedded into the joint portion in the softened state to make the top surface and the lateral surface of the at least one second metal bump being clad extendedly by compressing the joint portion in the softened state.

Abstract: The present invention relates to a wafer level package structure with a metal protection layer, and more particularly, to a wafer level package structure with a metal protection layer which is made of titanium, nickel, chromium or alloy thereof. The metal protection layer is adopted to prevent the substrate from being damaged by metal solder bumps. The metal protection layer also contributes to heat conduction and heat dissipation. Moreover, the metal protection layer is acid and alkali resistant and electromagnetic interference (EMI) resistant. The present invention improves the reliability of the IC component effectively.

Abstract: Apparatus for rotating a sunbather's lounge chair in the sun so that the sunbather lying on the chair is exposed to the sun even while the sun direction changes from sunrise to sunset includes a sun direction detector for detecting the relative direction of the sun direct rays to the chair and produces electrical signals representative of that relative direction, the chair being carried on a rotatable platform driven clockwise (CW) or counterclockwise (CCW) as requires to position the lounge chair in the direct rays of the sun; the sun direction detector including two directional photo-detectors on the rotatable platform, held with their directions normal to generally upright planes that meet at an angle less than 180.degree., and the drive driving the platform to maintain the outputs of the photo-detectors equal or in a predetermined relationship.

Abstract: An apparatus for optically controlling the volume of adhesive extruded from an orifice. A camera continuously monitors the adhesive discharged from the orifice; this adhesive is not applied to the target area until its volume is within preestablished limits. When the volume of adhesive is visually determined to be acceptable it is then applied to the target area. The camera is used again, to confirm the proper amount of adhesive has been applied to the target area by measuring the volume of adhesive remaining on the orifice after contacting the target area.

Abstract: A method of optically controlling the volume of adhesive extruded from an orifice. A camera continuously monitors the adhesive discharged from the orifice; this adhesive is not applied to the target area until its volume is within preestablished limits. When the volume of adhesive is visually determined to be acceptable it is then applied to the target area. The camera is used again, to confirm the proper amount of adhesive has been applied to the target area by measuring the volume of adhesive remaining on the orifice after contacting the target area.

Abstract: An optical video system for the inspection and repair of TAB lifted leads. Three distinct light sources are aligned at different angles to illuminate the side of a lead-solder-pad joint. Each of the surfaces of the joint are readily distinguished.