Patents by Inventor Fei-Tzu Lin

Fei-Tzu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEPOSITION METHOD USING A SUBSTRATE CARRIER
    Publication number: 20130302982
    Abstract: A deposition method comprises steps as follows. An apparatus for performing a thin-film deposition process is firstly provided, and the apparatus comprises a cabinet, a substrate carrier and a deposition source. The substrate carrier is disposed in the cabinet and comprises a cover element and a supporting element having a through hole. The deposition source is disposed in the cabinet. A substrate is subsequently disposed on the supporting element in order to make a deposition surface of the substrate exposed from the through hole. The cover element is then engaged with the supporting element to secure the substrate therebetween. Next, a deposition vapor is provided from the deposition source to get in touch with the deposition surface.
    Type: Application
    Filed: July 16, 2013
    Publication date: November 14, 2013
    Inventors: Chun-Hsing TUNG, Fei-Tzu LIN
  • Substrate carrier and applications thereof
    Patent number: 8534659
    Abstract: A substrate carrier for performing a deposition process comprises a supporting element and a cover element. The supporting element having a through hole is used to carry a substrate. The cover element is removably engaged with the supporting element, so as to secure the substrate therebetween and expose a deposition surface of the substrate from the through hole.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: September 17, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Chun-Hsing Tung, Fei-Tzu Lin
  • SUBSTRATE CARRIER AND APPLICATIONS THEREOF
    Publication number: 20130149870
    Abstract: A substrate carrier for performing a deposition process comprises a supporting element and a cover element. The supporting element having a through hole is used to carry a substrate. The cover element is removably engaged with the supporting element, so as to secure the substrate therebetween and expose a deposition surface of the substrate from the through hole.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 13, 2013
    Applicant: UNITED MICROELECTRONICS CORPORATION
    Inventors: Chun-Hsing Tung, Fei-Tzu Lin