Patents by Inventor Fei-Wu Wu

Fei-Wu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10825619
    Abstract: A resilient body and a keyboard structure are disclosed. The resilient body has a top portion, a bottom portion, a conducting post and an annular wall. The top portion has a first side wall and a first bottom surface. Before the resilient body is pressed, an angle is formed between the first side wall and the first bottom surface, wherein the angle is greater than 90°. The bottom portion has a second bottom surface. The conducting post is disposed under the first bottom surface. When the resilient body is pressed, the fire point of the resilient body is reached before the resilient body reaches the bottom point.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: November 3, 2020
    Assignee: CHICONY ELECTRONICS CO., LTD.
    Inventors: Fei-Wu Wu, Tsung-Min Chen, Liang-Yuan Yang
  • Publication number: 20200294738
    Abstract: A resilient body and a keyboard structure are disclosed. The resilient body has a top portion, a bottom portion, a conducting post and an annular wall. The top portion has a first side wall and a first bottom surface. Before the resilient body is pressed, an angle is formed between the first side wall and the first bottom surface, wherein the angle is greater than 90°. The bottom portion has a second bottom surface. The conducting post is disposed under the first bottom surface. When the resilient body is pressed, the fire point of the resilient body is reached before the resilient body reaches the bottom point.
    Type: Application
    Filed: September 17, 2019
    Publication date: September 17, 2020
    Inventors: FEI-WU WU, TSUNG-MIN CHEN, LIANG-YUAN YANG
  • Patent number: 10719136
    Abstract: A resilient element and a keyboard structure are disclosed. The resilient element has a top surface, a dent portion and a conducting post. The dent portion is located on the top surface and has an accommodating space. The conducting post has a post volume and is located beneath the dent portion. When the conducting post is pressed, at least a portion of the post volume enters the accommodating space.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: July 21, 2020
    Assignees: CHICONY ELECTRONICS CO., LTD., FUJITSU CLIENT COMPUTING LIMITED
    Inventors: Fei-Wu Wu, Pin-Fan Chuang, Hideyuki Fujikawa, Naoshige Nishiyama
  • Publication number: 20190187805
    Abstract: A resilient element and a keyboard structure are disclosed. The resilient element has a top surface, a dent portion and a conducting post. The dent portion is located on the top surface and has an accommodating space. The conducting post has a post volume and is located beneath the dent portion. When the conducting post is pressed, at least a portion of the post volume enters the accommodating space.
    Type: Application
    Filed: June 22, 2018
    Publication date: June 20, 2019
    Inventors: Fei-Wu Wu, Pin-Fan Chuang, Hideyuki Fujikawa, Naoshige Nishiyama