Patents by Inventor Fei-Yuh Chen

Fei-Yuh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backside coating for MEMS wafer
    Patent number: 7153768
    Abstract: A transparent substrate has a micro electro-mechanical system (MEMS) on a first side of the substrate. An opaque layer is formed on a second side of the transparent substrate opposite the first side. The opaque layer comprises a first material that is removable by a MEMS release process. A second layer is formed on the opaque layer. The second layer comprises a second material that prevents contamination of a front end of line machine by the first material during a front end of line fabrication process.
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: December 26, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co.
    Inventors: Fei-Yuh Chen, Eugene Chu, Yuh-Hwa Chang, David Ho
  • Backside coating for MEMS wafer
    Publication number: 20060177992
    Abstract: A transparent substrate has a micro electromechanical system (MEMS) on a first side of the substrate. An opaque layer is formed on a second side of the transparent substrate opposite the first side. The opaque layer comprises a first material that is removable by a MEMS release process. A second layer is formed on the opaque layer. The second layer comprises a second material that prevents contamination of a front end of line machine by the first material during a front end of line fabrication process.
    Type: Application
    Filed: February 10, 2005
    Publication date: August 10, 2006
    Inventors: Fei-Yuh Chen, Eugene Chu, Yuh-Hwa Chang, David Ho
  • Micromirror for MEMS device
    Patent number: 7057794
    Abstract: A micromirror which includes a substrate, a reflective layer comprising pure aluminum overlying the substrate and a protective layer comprising titanium nitride overlying the reflective layer is disclosed.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: June 6, 2006
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shen-Ping Wang, Yuh-Hwa Chang, Fei-Yuh Chen, David Ho, Chia-Chiang Chen
  • Mirror process using tungsten passivation layer for preventing metal-spiking induced mirror bridging and improving mirror curvature
    Publication number: 20060037933
    Abstract: A mirror process uses a tungsten passivation layer to prevent metal-spiking induced mirror bridging and improve mirror curvature. A mirror structure is patterned on a first sacrificial layer overlying a substrate. A tungsten passivation layer is then blanket deposited to cover the top and sidewalls of the mirror structure. A second sacrificial layer is formed overlying the tungsten passivation layer. A releasing process with an etchant including XeF2 is performed to remove the second sacrificial layer, the tungsten passivation layer and the first sacrificial layer simultaneously.
    Type: Application
    Filed: August 23, 2004
    Publication date: February 23, 2006
    Inventors: Wei-Ya Wang, Chung-Yuan Cheng, Tzu-Yang Wu, Keven Hung, Fei-Yuh Chen
  • Micromirror for MEMS divice
    Publication number: 20050259311
    Abstract: A micromirror which includes a substrate, a reflective layer comprising pure aluminum overlying the substrate and a protective layer comprising titanium nitride overlying the reflective layer is disclosed.
    Type: Application
    Filed: May 19, 2004
    Publication date: November 24, 2005
    Inventors: Shen-Ping Wang, Yuh-Hwa Chang, Fei-Yuh Chen, David Ho, Chia-Chiang Chen