Abstract: A method for manufacturing a support assembly and a method for manufacturing a micro light-emitting diode (LED) display are provided. The method for manufacturing the support assembly includes: forming an adhesive layer on a micro LED and/or a transient substrate; transferring the micro LED to the transient substrate, where the micro LED is bonded to the transient substrate through the adhesive layer; and forming the support assembly by etching the adhesive layer, where the support assembly is in a mesh shape and surrounds the micro LED.

Abstract: A transient-substrate assembly and a manufacturing method thereof are provided. The transient-substrate assembly includes a first substrate, a supporting layer, and light-emitting chips. The supporting layer is fixed on the first substrate, and defines multiple receiving cavities isolated from one another and at least one opening extending through a top surface and a bottom surface of the supporting layer. The multiple receiving cavities each have an opening away from the first substrate. The light-emitting chips are respectively disposed in the multiple receiving cavities. The light-emitting chip is located at a bottom of a corresponding receiving cavity and attached to the supporting layer. A side surface of the light-emitting chip and a side wall of the corresponding receiving cavity are separated by a gap.

Abstract: A light-emitting diode (LED) chip assembly and a preparing method thereof, and a preparing method of a display panel are provided. The LED chip assembly includes a patterned substrate, a patterned support layer, and multiple LED chips. The patterned substrate defines multiple through holes. The patterned support layer is disposed on a surface of the patterned substrate and attached to the patterned substrate. Each LED chip at least partially extends into each through hole. The each LED chip is partially embedded in the patterned support layer, and the each LED chip has a face surface away from the patterned support layer. The patterned support layer defines a hollow structure at a position opposite to a back surface of the each LED chip.