Abstract: Disclosed are an application start method and an electronic device. The method includes: obtaining, by a SystemServer process in an electronic device, a start message of a first application; sending, by the SystemServer process, a creation request for an application process to a daemon process in response to the start message, where the creation request includes application information of the first application; creating, by the daemon process, the application process for the first application in response to the creation request, where the application process includes a first thread and a second thread; executing, by the application process, the first thread and the second thread in parallel, where the first thread executes initialization of a main thread of the first application, and the second thread creates a first class loader according to the application information to load a class file of the first application.

Abstract: The disclosure relates to an automatic measuring system and a method thereof for drilling fluid parameters measurement. The system includes i. mud container, configured for test drilling fluid preparation and samples collection; ii. heat jacket, configured to keep the drilling fluid in the tank warm iii. heat exchanger, configured to simulate the practical conditions; iv. plunger pump, configured to pump the test drilling fluid to the flowing test device; v. flow test device, configured to simulate the flowing states of drilling fluid in the borehole annulus and drilling string, and also measure the pressure and flow rate of drilling fluid vi. control module, configured to obtain rheological parameters and the best rheological mode of the drilling fluid in the borehole annulus and drilling string based on the pressure and flow rate.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to enable customization of pigtail lengths of optical connectors. Disclosed is an apparatus comprising an affixed fiber array unit plug including a first optical fiber, a detachable fiber array unit plug including a second optical fiber, the detachable fiber array unit plug to be removably coupled to the affixed fiber array unit plug, and guide pins to interface with both the detachable fiber array unit plug and the affixed fiber array unit plug when coupled together, the guide pins to facilitate alignment of the first optical fiber with the second optical fiber.

Abstract: A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.

Abstract: Disclosed are an application start method and an electronic device. The method includes: obtaining, by a SystemServer process in an electronic device, a start message of a first application; sending, by the SystemServer process, a creation request for an application process to a daemon process in response to the start message, where the creation request includes application information of the first application; creating, by the daemon process, the application process for the first application in response to the creation request, where the application process includes a first thread and a second thread; executing, by the application process, the first thread and the second thread in parallel, where the first thread executes initialization of a main thread of the first application, and the second thread creates a first class loader according to the application information to load a class file of the first application.

Abstract: In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

Abstract: Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

Abstract: Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

Abstract: Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

Abstract: Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.