Abstract: An optical connector, a semiconductor assembly including the optical connector, a multi-chip package including the optical connector, and a method of making the optical connector. The optical connector includes: a first lid; and a second lid attached to the first lid to define a cavity therebetween. Individual ones of the first lid and the second lid include: a substrate having an inner surface facing the cavity, an outer surface opposite the inner surface, a first end and a second end, the first end to receive a corresponding waveguide therein; and a concave mirror on the substrate and having a reflective surface facing the cavity, wherein a straight linear optical axis is to extend between the reflective surface of the concave mirror and a photonic structure at an opposing one of said individual ones of the first lid and the second lid.

Abstract: Architectures and methods for graded index (GRIN) lens expanded beam (EB) coupler for detachable fiber array unit (FAU) for use with a photonic integrated circuit (PIC). A system to optically couple a fiber optic array (FAU) to a PIC die includes a graded index (GRIN) lens to optically couple a single mode fiber (SMF) in the FAU to a waveguide in the PIC die. The GRIN lens has a first mode field diameter (MFD) that is a function of a spot size converter of the waveguide. The SMF is a conduit for optical light with a wavelength and a second MFD. The GRIN lens has a length that is a function of a predetermined whole number of periodic cycles of the wavelength.

Abstract: An apparatus includes an optical fiber coupled with a photonic integrated circuit (PIC) die. A first optical feature is at an end face of the optical fiber. The first optical feature tapers in a first longitudinal direction from a first base end proximal to the end face to a first tapered end. A second optical feature is at a surface of the PIC die. The second optical feature tapers in a second longitudinal direction from a second base end proximal to the surface to a second tapered end. The first optical feature is adjacent to, and may be longitudinally aligned with or parallel to, the second optical feature.

Abstract: An optical fiber housing comprises a first face, a second face opposite the first face, a first side, and a second side opposite the first side. The first face is spaced apart from the second face by a first distance. A plurality of optical fibers extends in a longitudinal direction between the first and second faces, and are laterally spaced apart across a transverse width of the first face between the first side and the second side. Each optical fiber comprises a diameter. A surface of the housing is orthogonal to the first face and the first side. A plurality of alignment features is on the surface stand off from a remainder of the surface by a height greater than the diameter. The alignment features extend a second distance in the longitudinal direction that is less than the first distance, and comprises a curved or V-shaped peripheral surface.

Abstract: Assemblies comprising semiconductor devices, heat spreaders, and fiber-based input output (IO) connections are provided. Methods of manufacturing assemblies comprising semiconductor devices, heat spreaders, and fiber-based input output (IO) connections are also provided.

Abstract: Expanded beam optical fibers, and methods of forming the same, are disclosed herein. In one example, an optical fiber includes a first optical fiber section with a photonic crystal fiber, a second optical fiber section with a mode field adapter fiber, and a third optical fiber section with a single mode fiber. The first optical fiber section is coupled to the second optical fiber section, and the second optical fiber section is coupled to the third optical fiber section.

Abstract: In the various aspects, an optical package includes an optical connector that is at least partially configured with a first thickness that is less than a second thickness of the optical package. The optical package includes an assembly platform, a photonic integrated circuit disposed on the assembly platform, and the optical connector includes a housing with a first section and a second section, and an attachment assembly. In an aspect, the first section of the housing is disposed proximally to an edge of the assembly platform and is coupled to the photonic integrated circuit in the optical package, and the second section of the housing is coupled to a fiber optic jumper, and the attachment assembly joins the second section to the first section and enables the second section to be detached from the first section.

Abstract: Photonic IC packages, related devices and methods, are disclosed herein. In some embodiments, a photonic package may include a substrate including a dielectric material with conductive pathways; a photonic integrated circuit (PIC) having a first optical element, the PIC electrically coupled to the substrate; a connector including a fiber alignment structure; and a second optical element, wherein the second optical element is to expand and collimate an optical beam; and a fiber having a first end and an opposing second end, wherein the fiber is positioned in the fiber alignment structure, and wherein the first end of the fiber is optically coupled to the first optical element and the second end of the fiber is optically coupled to the second optical element.

Abstract: Embodiments disclosed herein comprise an apparatus with a substrate with a first surface, and a second surface that is recessed from the first surface. In an embodiment, the second surface is adjacent to an edge of the substrate. In an embodiment, a hole is in the second surface, and a groove is in the first surface. In an embodiment, a centerline of the groove passes over the hole.

Abstract: A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.

Abstract: Technologies for fiber array unit (FAU) lid designs are disclosed. In one embodiment, channels in the lid allow for suction to be applied to fibers that the lid covers, pulling the fibers into place in a V-groove. The suction can hold the fibers in place as the fiber array unit is mated with a photonic integrated circuit (PIC) die. Additionally or alternatively, channels can be on pitch, allowing for pulling the FAU towards a PIC die as well as sensing the position and alignment of the FAU to the PIC die. In another embodiment, a warpage amount of a PIC die is characterized, and a FAU lid with a similar warpage is fabricated, allowing for the FAU to position fibers correctly relative to waveguides in the PIC die. In another embodiment, a FAU has an extended lid, which can provide fiber protection as well as position and parallelism tolerance control.

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

Abstract: In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

Abstract: Disclosed are an application start method and an electronic device. The method includes: obtaining, by a SystemServer process in an electronic device, a start message of a first application; sending, by the SystemServer process, a creation request for an application process to a daemon process in response to the start message, where the creation request includes application information of the first application; creating, by the daemon process, the application process for the first application in response to the creation request, where the application process includes a first thread and a second thread; executing, by the application process, the first thread and the second thread in parallel, where the first thread executes initialization of a main thread of the first application, and the second thread creates a first class loader according to the application information to load a class file of the first application.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to enable customization of pigtail lengths of optical connectors. Disclosed is an apparatus comprising an affixed fiber array unit plug including a first optical fiber, a detachable fiber array unit plug including a second optical fiber, the detachable fiber array unit plug to be removably coupled to the affixed fiber array unit plug, and guide pins to interface with both the detachable fiber array unit plug and the affixed fiber array unit plug when coupled together, the guide pins to facilitate alignment of the first optical fiber with the second optical fiber.

Abstract: A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.

Abstract: Disclosed are an application start method and an electronic device. The method includes: obtaining, by a SystemServer process in an electronic device, a start message of a first application; sending, by the SystemServer process, a creation request for an application process to a daemon process in response to the start message, where the creation request includes application information of the first application; creating, by the daemon process, the application process for the first application in response to the creation request, where the application process includes a first thread and a second thread; executing, by the application process, the first thread and the second thread in parallel, where the first thread executes initialization of a main thread of the first application, and the second thread creates a first class loader according to the application information to load a class file of the first application.

Abstract: In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.