Abstract: Disclosed are an isolation type power conversion method based on demagnetization iteration control and a power conversion circuit. The power conversion circuit comprises a high-frequency transformer, wherein a primary side of the high-frequency transformer is electrically connected with a primary side power tube in a power switch tube circuit, a secondary side of the high-frequency transformer is electrically connected with a charging capacitor circuit and an output feedback circuit through a secondary side synchronous rectifier tube, and the primary side and the secondary side of the high-frequency transformer are electrically connected with a power conversion integrated control chip.

Abstract: Disclosed are an isolation type power conversion method based on demagnetization iteration control and a power conversion circuit. The power conversion circuit comprises a high-frequency transformer, wherein a primary side of the high-frequency transformer is electrically connected with a primary side power tube in a power switch tube circuit, a secondary side of the high-frequency transformer is electrically connected with a charging capacitor circuit and an output feedback circuit through a secondary side synchronous rectifier tube, and the primary side and the secondary side of the high-frequency transformer are electrically connected with a power conversion integrated control chip.

Abstract: Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.

Abstract: A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level.

Abstract: A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level.

Abstract: Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.