Patents by Inventor Feiyu LUO

Feiyu LUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit die and manufacture method thereof
    Patent number: 10607913
    Abstract: The present invention provide an IC die, including an underlay; an active component; an interconnection layer, covering the active component, where the interconnection layer includes multiple metal layers and multiple dielectric layers, the multiple metal layers and the multiple dielectric layers are alternately arranged, a metal layer whose distance to the active component is the farthest in the multiple metal layers includes metal cabling and a metal welding pad; and a heat dissipation layer, where the heat dissipation layer covers a region above the interconnection layer except a position corresponding to the metal welding pad, the heat dissipation layer is located under a package layer, the package layer includes a plastic packaging material, and the heat dissipation layer includes an electrical-insulating material whose heat conductivity is greater than a preset value.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 31, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: HuiLi Fu, Shujie Cai, Feiyu Luo
  • INTEGRATED CIRCUIT DIE AND MANUFACTURE METHOD THEREOF
    Publication number: 20180068922
    Abstract: The present invention provide an IC die, including an underlay; an active component; an interconnection layer, covering the active component, where the interconnection layer includes multiple metal layers and multiple dielectric layers, the multiple metal layers and the multiple dielectric layers are alternately arranged, a metal layer whose distance to the active component is the farthest in the multiple metal layers includes metal cabling and a metal welding pad; and a heat dissipation layer, where the heat dissipation layer covers a region above the interconnection layer except a position corresponding to the metal welding pad, the heat dissipation layer is located under a package layer, the package layer includes a plastic packaging material, and the heat dissipation layer includes an electrical-insulating material whose heat conductivity is greater than a preset value.
    Type: Application
    Filed: October 30, 2017
    Publication date: March 8, 2018
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: HuiLi FU, Shujie CAI, Feiyu LUO