Abstract: Embodiments herein describe techniques for binning integrated circuits (ICs) using an adaptive binning system that can re-bin the ICs in response to receiving a new or updated test specification. Unlike static binning systems, in one embodiment, the binning system receives measured test data from a testing system. Put differently, instead of a testing apparatus simply indicating whether an IC does (or does not) satisfy the criteria in the test specification, the testing apparatus provides measured test data to the binning system. The binning apparatus can then store the received test data. As such, if a new test specification is received or generated, the binning system can use the already saved test data to re-bin the ICs using the criteria in the new test specification without having to re-test the ICs. In this manner, the binning system can re-categorize the ICs as customer needs or customer demand changes.

Abstract: An integrated circuit (IC) chip package assembly apparatus and techniques for assembling IC chip packages are described. For example, a techniques for fabricating an IC package include (A) determining a first package assembly yield (PAY) across a first die pool comprising a first plurality of dies having a performance criteria within a first predefined range; (B) determining a second PAY across a second die pool comprising a second plurality of dies having a performance criteria within a second predefined range of performance criteria that is different than the first predefined range of performance criteria, the second plurality of dies comprising a portion of the first plurality of dies; and (C) generating a final assembly sequence in response to analyzing the first and second PAYs, the final assembly sequence comprising rules for combining dies in accordance with obtaining a higher of the first PAY and the second PAY.