Abstract: A sensor may detect a coolant leak at or near an appliance that is slidable between a seated position and an ejected position relative to a rack. In the seated position, a coolant supply line may be coupled with a conduit of the appliance to convey coolant past the appliance. A biaser can bias the appliance toward the ejected position, and a latch may secure the appliance in a seated position against the biaser. A releaser can release the latch in response to coolant leak detection by the sensor and permit the biaser to move the appliance toward the ejected position, for example, which may cause the conduit to become disconnected from the coolant supply line to cut off flow to the leak.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.

Abstract: A rack computer system can provide data indicating electrical power consumption by separate sets of the mass storage devices, including separate individual mass storage devices, of the rack computer system. A power sensor can be electrically coupled to a power transmission line for each mass storage device. The power sensor can be coupled to the power transmission line externally to the mass storage device. The power sensor can be an internal power sensor of the mass storage device, where a mass storage device microcontroller transmits internally-generated data to an external power monitoring system. A microcontroller can transmit the data to a baseboard management controller via a side-band connection between the mass storage device and the controller. The data can be transmitted via an in-band connection between a baseboard management controller and an instance of firmware which accesses internally-generated data from mass storage device microcontrollers.

Abstract: A computing system includes a circuit board assembly and multiple expansion cards connected to one another and also connected to the circuit board assembly. The connected expansion cards form a modular expansion card bus that allows the expansion cards to communicate between each other without routing the communications through the circuit board assembly. In some embodiments, the expansion cards are mounted on a tray that includes mounting pins that engage mounting slots of the expansion cards, allowing for simple installation of various combinations of expansion cards connected together to form a modular expansion card bus.

Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.

Abstract: A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.

Abstract: Systems, devices, and methods for monitoring flexible tubing connections are described. An example flexible tube device may include a pair of ends and an opening disposed at one of the ends. The opening may define a receiving section to receive a male fitting. The flexible tube may also include a sensing device extending within the flexible tube at the receiving section. The sensing device may be configured to sense an expansion or a contraction of the flexible tube at the receiving section.

Abstract: A rack computer system can provide data indicating electrical power consumption by separate sets of the mass storage devices, including separate individual mass storage devices, of the rack computer system. A power sensor can be electrically coupled to a power transmission line for each mass storage device. The power sensor can be coupled to the power transmission line externally to the mass storage device. The power sensor can be an internal power sensor of the mass storage device, where a mass storage device microcontroller transmits internally-generated data to an external power monitoring system. A microcontroller can transmit the data to a baseboard management controller via a side-band connection between the mass storage device and the controller. The data can be transmitted via an in-band connection between a baseboard management controller and an instance of firmware which accesses internally-generated data from mass storage device microcontrollers.

Abstract: An assembly for containing and detecting leaks from a coolant line includes a basin with side and end walls, and at least one U-shaped cavity in an end wall for receiving a coolant line of a liquid cooling system. A bottom of the basin includes at least one sloped interior surface arranged to divert water in the basin to a local low point, where a sensor is positioned and operable to detect liquid in the collection basin. A leak detection system can employ a leak detection assembly to detect and/or locate a leak.

Abstract: A server system includes a server chassis with one or more composite walls that provide structural stiffness for the server chassis. The one or more composite walls also include one or more air passages that permit air to flow through the composite walls. Each composite wall comprises at least two plates and one or more spacing devices that separate the at least two plates. Air passages are included in the composite wall between the at least two plates separated by the spacing devices and one or more openings permit air flowing through the air passages of the composite wall to flow out of the composite wall and across server devices mounted in the server chassis that includes the composite wall.

Abstract: A server rack comprises a plurality of slots and a plurality of computing devices. Individual ones of the computing devices are mounted within individual ones of the slots. The server rack also comprises a plurality of slot-level thermal regulation systems. At least one of the slot-level thermal regulation systems comprises a louver corresponding to a particular slot and located between a particular computing device mounted within the particular slot and at least one fan configured to facilitate airflow through the server rack. The louver is configured to regulate airflow through the particular computing device. The at least one slot-level thermal regulation system further comprises a thermally activated unit located in an exhaust flow of the particular computing device and configured to change the angle of the louver in response to a change in thermal energy of the exhaust flow.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.

Abstract: A rack computer system can provide data indicating electrical power consumption by separate sets of the mass storage devices, including separate individual mass storage devices, of the rack computer system. A power sensor can be electrically coupled to a power transmission line for each mass storage device. The power sensor can be coupled to the power transmission line externally to the mass storage device. The power sensor can be an internal power sensor of the mass storage device, where a mass storage device microcontroller transmits internally-generated data to an external power monitoring system. A microcontroller can transmit the data to a baseboard management controller via a side-band connection between the mass storage device and the controller. The data can be transmitted via an in-band connection between a baseboard management controller and an instance of firmware which accesses internally-generated data from mass storage device microcontrollers.

Abstract: A computing system includes a circuit board assembly and multiple expansion cards connected to one another and also connected to the circuit board assembly. The connected expansion cards form a modular expansion card bus that allows the expansion cards to communicate between each other without routing the communications through the circuit board assembly. In some embodiments, the expansion cards are mounted on a tray that includes mounting pins that engage mounting slots of the expansion cards, allowing for simple installation of various combinations of expansion cards connected together to form a modular expansion card bus.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.

Abstract: A power monitoring system which is communicatively coupled to power sensors in one or more rack computer systems, where the power sensors generate data indicating electrical power consumption by mass storage devices in the racks, can manage a data center design which includes various specifications that a future data center constructed according to the data center design include particular data center components which at least meet one or more specified structural parameters associated with the one or more particular data center components. Such management includes determining a value of at least one structural parameter associated with at least one particular data center component, based at least in part upon electrical power consumption by a set of mass storage devices installed in one or more data centers. The management can include adjusting cooling capacity specifications, power supply capacity specifications, mass storage device maximum operating temperatures, etc.

Abstract: A computing system includes a circuit board assembly and multiple expansion cards connected to one another and also connected to the circuit board assembly. The connected expansion cards form a modular expansion card bus that allows the expansion cards to communicate between each other without routing the communications through the circuit board assembly. In some embodiments, the expansion cards are mounted on a tray that includes mounting pins that engage mounting slots of the expansion cards, allowing for simple installation of various combinations of expansion cards connected together to form a modular expansion card bus.

Abstract: A cooling canister includes a canister body and a sealing surface that seals with a subset of servers mounted in a rack. A cooling canister facilitates airflow isolation between subsets of servers mounted in a rack and is configured to couple with one or more fans that direct airflow through the subset of servers coupled with the cooling canister. In some embodiments, a cooling canister includes louvers configured to restrict airflow through empty rack slots to which the cooling canister is coupled.

Abstract: A system is described wherein power degradation can be used in conjunction with predictive failure analysis in order to accurately determine when a hardware component might fail. In one example, printed circuit boards (PCBs) can unexpectedly malfunction due to a variety of reasons including silicon power variation or air mover speed. Other hardware components can include silicon or an integrated circuit. In order to accurately monitor the hardware component, telemetry is used to automatically receive communications regarding measurements of data associated with the hardware component, such as power-related data or temperature data. The different temperature data can include junction temperature or ambient air temperature to determine an expected power usage. The actual power usage is then compared to the expected power usage to determine whether the hardware component can soon fail.