Abstract: A process for vapor phase soldering of electronic components comprises applying to the surface of a substrate or to the surface of components on such substrate a solder cream comprising 85 to 90% of finely divided solder metal and 10 to 15% of a fluorinated tertiary alkylamine, preferably a perfluorotrihexyl amine, by weight of the sum of the two components, and positioning electronic components on the substrate, with contacts of such components on the solder cream-coated surface. The substrate is placed in a chamber in contact with the boiling vapors of a second liquid fluorinated tertiary alkylamine having a lower boiling point than the fluorinated tertiary alkylamine in the solder cream, preferably perfluorotriamyl amine, in the chamber, and melting the solder metal in the solder cream and fusing the solder joints of the electronic components to form solder joints substantially free of organic residue.

Abstract: A test assembly for testing a high density circuit or a test board, which comprises a test head containing a mirror image circuit of the circuit to be tested on the test board, a plurality of test points on the test head circuit, the test points comprising a plurality of metal pads, and metal contacts soldered to the metal pads, the metal contacts being in the form of metal balls or flakes selected from the group consisting of brass, bronze or copper, of a size ranging from about 5 to about 30 mils. The test head is positiioned over the test board with the metal contacts on the test head in contact with corresponding test points on the high density circuit on the test board. Means are provided for connecting the circuit on the test head with a tester, thereby providing signals from the high density circuit under test through the test head circuit to the tester. A solder composition is provided which is especially adapted for soldering the metal contacts to the metal pads on the test head.

Abstract: A solder composition or solder cream especially adapted for vapor phase soldering in electronic circuits without formation of organic residues, comprises a major portion of finely divided solder metal and a minor portion of a fluorinated tertiary alkylamine. Preferably, the composition consists essentially of 85 to 90% of solder metal and 10 to 15% of perfluorotrihexyl amine. A small amount of an organic brominated activator such as homocyclohexane, can be added to convert any lead oxide or tin oxide present in the solder metal, to the corresponding bromides, and a small amount of solvent can be incorporated to disperse the activator in the solder composition. The fluorinated amine vehicle of the solder cream is compatible with and dissolves in the perfluorotriamyl amine, commonly used as the heating medium in vapor phase soldering, and the amine vehicle, perfluorotrihexyl amine, can be recovered from the solution by distillation, for reuse.

Abstract: A soldering composition containing at least 85% and less than 90% by weight of finely divided solder metal and a minor portion of a vehicle for the solder metal, consisting essentially of a rosin-type flux, a thickening agent and a minor portion, about 2 to about 7%, of a fluorinated tertiary alkylamine, particularly a perfluorotrihexyl amine. During vapor-phase soldering, the amine component is washed from the solder composition, leaving solder metal, rosin-type flux and thickening agent, in the remaining composition, the composition at this stage containing about 90% solder metal, and yielding dense solder joints, essentially no solder balls, and minimal residue.

Abstract: A solder composition containing a small amount of aluminum added to the solder metal, to avoid cracking of solder joints in electronic circuits, particularly densely packed microelectronic circuits, during thermal cycling. The solder composition comprises 85 to 90% of total solder metal and 10 to 15% of a vehicle for the solder metal, the solder metal containing about 0.2 to about 3% of particulate aluminum, by weight of the solder metal.

Abstract: A solder composition containing a small amount of gold added to the solder metal, to avoid cracking of solder joints in electronic circuits, particularly densely packed microelectronic circuits, during thermal cycling. The solder composition comprises 85 to 90% of total solder metal and 10 to 15% of a vehicle for the solder metal, the solder metal containing about 0.2 to about 3% of particulate gold, by weight of the solder metal.

Abstract: Novel solder composition or solder cream, particularly adapted for high speed soldering of components in electronic circuits, whereby movement of components is avoided and essentially no solder balls are formed, comprising between 10 and 14% of a vehicle and between 86 and 90% of solder metal dispersed in the vehicle, preferably employing solder metal of particle size ranging from about 40 to about 70 microns, and utilizing as solvent in the vehicle a low volatile high molecular weight alcohol, preferably a primary aliphatic monoalcohol containing about 8 to about 18 carbon atoms, e.g., cetyl alcohol, in an amount of about 10 to about 50% by weight of the vehicle.

Abstract: Novel solder composition or solder cream, particularly adapted for soldering components in high-density electronic circuits, e.g., fusing electrical components to small pads of the order of 10 mils square or smaller, comprising a narrow range of between 10 and 14% flux-containing vehicle and between 86 and 90% of solder metal, and employing solder metal of particle size ranging from about 0.2 to about 35 microns.

Abstract: Novel solder composition or solder cream, particularly adapted for soldering components in electronic circuitry, comprising finely divided solder metals such as tin and lead, dispersed in a vehicle containing viscosity controlling agents, organic solvents, and a rosin or rosin derivative as a flux. By employing a narrow range of rosin-containing vehicle, that is between 13 and 14%, and between 86 and 87% of solder metal, by weight of the solder composition, and fine particle size solder metal of from 40 to 70 microns, the formation of solder balls is essentially eliminated, thus avoiding the necessity of removing such solder balls.