Patents by Inventor Felix Cohen

Felix Cohen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6354912
    Abstract: Two blades are arranged oppositely at a predetermined interval along the Y-axis. The two blades cut a wafer along two cutting lines at the same time while the two blades are moving along the X-axis. After the wafer is cut along these two cutting lines, the two blades are moved along the Y-axis by one pitch of the cutting lines so that the wafer can be cut along the next two cutting lines. This action is repeated to cut the wafer along the cutting lines continuously. This wafer cutting method can hold the movement of the blades along the X-axis to a minimum because of the oppositely-arranged two blades. Consequently, the wafer can be cut in a short period of time.
    Type: Grant
    Filed: December 2, 1998
    Date of Patent: March 12, 2002
    Assignees: Tokyo Seimitsu Co., Ltd., Kulicke & Soffa Investments, Inc.
    Inventors: Masateru Osada, Masayuki Azuma, Hirofumi Shimoda, Felix Cohen