Patents by Inventor Felix Ejeckham

Felix Ejeckham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Handle for semiconductor-on-diamond wafers and method of manufacture
    Patent number: 9882007
    Abstract: Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: January 30, 2018
    Assignee: RFHIC Corporation
    Inventors: Quentin Diduck, Daniel Francis, Frank Yantis Lowe, Felix Ejeckham
  • SEMICONDUCTOR DEVICES WITH IMPROVED RELIABILITY AND OPERATING LIFE AND METHODS OF MANUFACTUIRNG THE SAME
    Publication number: 20150279945
    Abstract: Methods for manufacturing semiconductor wafer structures are described which exhibit improved lifetime and reliability. The methods comprise transferring an active semiconductor layer structure from a native non-lattice-matched semiconductor growth substrate to a working substrate, wherein strain-matching layers, and optionally a portion of the active semiconductor layer structure, are removed. In certain embodiment, the process of attaching the active semiconductor layer structure to the working substrate includes annealing at an elevated temperature for a specified time.
    Type: Application
    Filed: October 25, 2013
    Publication date: October 1, 2015
    Inventors: Daniel Francis, Dubravko Babic, Firooz Nasser-Faili, Felix Ejeckham, Quentin Diduck, Joseph Smart, Kristopher Matthews, Frank Lowe
  • HANDLE FOR SEMICONDUCTOR-ON-DIAMOND WAFERS AND METHOD OF MANUFACTURE
    Publication number: 20150200254
    Abstract: Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.
    Type: Application
    Filed: July 2, 2013
    Publication date: July 16, 2015
    Inventors: Quentin Diduck, Daniel Francis, Frank Yantis Lowe, Felix Ejeckham