Abstract: An inline particle sensor includes a sensor head configured to mount within a fitting, the sensor head including a laser source sealed and isolated from a sensing volume and configured to emit a laser beam through the sensing volume and a detector arranged to detect particles in the sensing volume that pass through the laser beam. The vacuum particle sensor further includes electronics coupled to the sensor head and configured to receive a signal indicative of the particles from the detector and provide a particle output based on the signal.

Abstract: A wafer-like semiconductor sensor includes a wafer-like base formed of a plurality of layers of chemically-hardened glass and an electronics module mounted to a recessed pocket in the base and containing a sensor.

Abstract: An inline particle sensor includes a sensor head configured to mount within a fitting, the sensor head including a laser source sealed and isolated from a sensing volume and configured to emit a laser beam through the sensing volume and a detector arranged to detect particles in the sensing volume that pass through the laser beam. The vacuum particle sensor further includes electronics coupled to the sensor head and configured to receive a signal indicative of the particles from the detector and provide a particle output based on the signal.

Abstract: A substrate-like particle sensor includes a substrate-like base portion and an electronics enclosure disposed on the substrate-like base portion. A power source is located within the electronics enclosure. A controller is operably coupled to the power source. A particle sensor is operably coupled to the controller and provides an indication to the controller of at least one particle present near the particle sensor.

Abstract: A wireless illumination sensing assembly for sensing a property of illumination within a semiconductor processing environment is provided. The sensing assembly has a power source and a wireless communication module coupled to the power source. Measurement circuitry is also provided. At least one illumination sensor having an electrical characteristic that varies with the property of illumination. The illumination sensor(s) is/are coupled to the measurement circuitry.

Abstract: A high-temperature sensing system for sensing at least one parameter of interest within a high-temperature environment is provided. The system includes a substrate having at least one electrical network disposed thereon. Each of the at least one electrical network is a tuned circuit having a resonant frequency, and a temperature sensitive electrical component that varies the resonant behavior of the tuned circuit with a parameter of interest. An antenna is disposed to interact with the at least one electrical network. Transmit/receive electronics are spaced from the high-temperature environment and coupled to the antenna. The transmit/receive electronics are configured to generated selected drive signals to address each of the at least one electrical network and to detect a modulated radio-frequency reflection. A processor is coupled to the transmit/receive electronics and configured to calculate a parameter of interest for each detected modulated radio-frequency reflection.

Abstract: A substrate-like particle sensor includes a substrate-like base portion and an electronics enclosure disposed on the substrate-like base portion. A power source is located within the electronics enclosure. A controller is operably coupled to the power source. A particle sensor is operably coupled to the controller and provides an indication to the controller of at least one particle present near the particle sensor.

Abstract: An improved laser-based wafer carrier mapping sensor is provided. The sensor includes a number of improvements including laser source improvements; optical improvements; and detector improvements. Laser source improvements include the type of laser sources used as well as the specification of size and power of such sources. Optical improvements include features that intentionally defocus the laser stripe on the wafer as well as additional features that help ensure precision stripe generation. Detector improvements include increasing gain while decreasing the effects of ambient light. Various combinations of these features provide additional synergies that facilitate the construction of a sensor with significantly improved dynamic response while decreasing the frequency of false cross slot errors.

Abstract: An improved laser-based wafer carrier mapping sensor is provided. The sensor includes a number of improvements including laser source improvements; optical improvements; and detector improvements. Laser source improvements include the type of laser sources used as well as the specification of size and power of such sources. Optical improvements include features that intentionally defocus the laser stripe on the wafer as well as additional features that help ensure precision stripe generation. Detector improvements include increasing gain while decreasing the effects of ambient light. Various combinations of these features provide additional synergies that facilitate the construction of a sensor with significantly improved dynamic response while decreasing the frequency of false cross slot errors.

Abstract: A light source comprises a high intensity lamp that is clamped between four half-shell finned heatsinks. The upper heatsink half-shells for the anode and cathode ends of the lamp are mounted to an upper printed circuit board and the lower heatsink half-shells are mounted to a lower main printed circuit board. A direct current powered fan is positioned on one side to blow horizontally through the matrix of heatsinks and out the opposite side. Only the lamp igniter and fan power supply circuits are included in the upper printed circuit board which receives lamp power from the lower printed circuit boards through the anode and cathode heatsinks and one additional connection comprising a flexible wire. The main power supply is included on the lower printed circuit board and it converts and preregulates 110 VAC or 220 VAC to 160 VDC to a transistor chopping switch that in turn provides the required low voltage lamp power.

Abstract: The present invention comprises a transformer having a magnetic core that is smaller and shorter than the winding form for the primary and secondary coils, the core is surrounded by an sound deadening and insulating material, such as foam, and is encased in a sealed tube.

Abstract: A method and resulting laser tube apparatus constructed from a plurality of components adapted to be arranged in axial alignment and selfsupporting with respect to each other. The elements are adapted to withstand high baking temperatures and are provided at their mating surfaces with material capable of forming a flowable seal between the components during baking and subsequently solidifying to a hermetic seal upon cooling. End adjustment mirror mountings which combine adjustable functions together with desirable electrical properties are also disclosed, together with procedures for obtaining optical alignment of the resultant tube product.

Abstract: A method and resulting laser tube apparatus constructed from a plurality of components adapted to be arranged in axial alignment and self supporting with respect to each other. The elements are adapted to withstand high baking temperatures and are provided at their mating surfaces with material capable of forming a flowable seal between the components during baking and subsequently solidifying to a hermetic seal upon cooling. End adjustment mirror mountings which combine adjustable functions together with desirable electrical properties are also disclosed, together with procedures for obtaining optical alignment of the resultant tube product.