Patents by Inventor Felix KOCH

Felix KOCH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240110085
    Abstract: One-component toughened epoxy structural adhesives contain fibrous mineral fillers that have an aspect ratio of ?6. The presence of the fibrous filler leads to a significant increase in elastic modulus while having little if any adverse effect on other properties such as dynamic impact peel resistance.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 4, 2024
    Inventors: FELIX KOCH, SERGIO GRUNDER, ANDREAS LUTZ
  • Publication number: 20240093072
    Abstract: One-component epoxy adhesives containing a phosphorus-modified epoxy resin, a toughener and an epoxy resin that is neither rubber-modified nor phosphorus-modified. These adhesives are structural adhesives useful in automotive applications. They exhibit particularly good corrosion resistance.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 21, 2024
    Inventors: Felix Koch, Andreas Lutz, Cathy Grossnickel, Jeannine Flueckiger
  • Patent number: 11820922
    Abstract: An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 800 Pa s at a temperature of 15° C.; and wherein the viscosity of the above liquid resin system is greater than about 5 Pa-s at a temperature of 60° C.; (II) a solid material comprising: (c) at least one hydrophobic fumed silica, wherein the fumed silica is present in the adhesive composition at a concentration of greater than 5 weight percent; and (III) a curative material comprising: (d) at least one latent heat-activated curing agent; wherein the rheology of the epoxy-based crash durable adhesive composition is such that the adhesive composition is pumpable at a temperature of 15° C.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: November 21, 2023
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
    Inventors: Tyler Auvil, Gary L. Jialanella, Eric E. Cole, Felix Koch, Andreas Lutz, Daniel Schneider
  • Publication number: 20230365845
    Abstract: Provided herein is a one-component adhesive composition showing excellent adhesive strength after heat and humidity exposure.
    Type: Application
    Filed: August 18, 2021
    Publication date: November 16, 2023
    Inventors: Andreas Lutz, Felix Koch, Jeannine Flueckiger
  • Patent number: 11674063
    Abstract: Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles. The one-component epoxy resin adhesive compositions exhibit improved toughness of the adhesive as measured by its lap shear strength as well as improved environmental stability, i.e., corrosion protection, by addition of the zinc oxide nanoparticles when applied to metal substrates.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: June 13, 2023
    Assignee: DDP Specialty Electronic Materials US, LLC
    Inventors: Felix Koch, Andreas Lutz, Beda Steiner, Cathy Grossnickel, Jeannine Flueckiger
  • Publication number: 20230060754
    Abstract: Disclosed herein are thermal interface materials comprising thermoset binder component and a mixture of spherically shaped and thermally conductive fillers and the use thereof in battery powered vehicles.
    Type: Application
    Filed: March 24, 2021
    Publication date: March 2, 2023
    Inventors: Nina Hillesheim, Sergio Grunder, Andreas Lutz, Michelle Kuster, Sophie Lutz, Felix Koch
  • Publication number: 20220411625
    Abstract: Disclosed herein are thermal interface material comprising liquid epoxy resin that is free of aromatic groups and high loading of aluminum trihydroxide and the use thereof in battery powered vehicles.
    Type: Application
    Filed: October 6, 2020
    Publication date: December 29, 2022
    Inventors: Sergio Grunder, Sophie Lutz, Andreas Lutz, Nina Hillesheim, Felix Koch
  • Publication number: 20220228045
    Abstract: Disclosed is an adhesive system and method of use thereof wherein the adhesive composition comprises a moisture curable adhesive comprised of an isocyanate terminated prepolymer and a cure accelerator having two curatives components having different cure kinetics. The cure accelerator is comprised of an isocyanate reactive compound comprising a primary, secondary or tertiary amino group, or a primary thiol group having faster curing kinetics resulting an increase in bead stability within the first minutes and a polyol selected from a diol and/or triol with slower curing kinetics allowing for sufficient open time and yet a fast strength build up. The preferred method of application of the adhesive system is via a 1K application gun.
    Type: Application
    Filed: June 18, 2020
    Publication date: July 21, 2022
    Inventors: FELIX KOCH, STEFAN SCHMATLOCH, EDWIN ZUEGER, GABRIELE TASSELLI, SERGIO GRUNDER, FILIPPO ARDIZZONE, ANDREAS LUTZ
  • Publication number: 20220204820
    Abstract: Disclosed is epoxy adhesive composition that combine the benefits of both 1K and 2K technologies in one system which demonstrates a good balance of fast fixation, curing speed, desirable mechanical performance, durability, and good oil adsorption once cured. Said epoxy adhesive composition comprising an epoxy resin, a reactive urethane group- and/or urea group-containing polymer having capped isocyanate, an epoxy curing catalyst, a dicyandiamide, and a hardener.
    Type: Application
    Filed: April 17, 2020
    Publication date: June 30, 2022
    Inventors: Felix Koch, Beda Steiner, Andreas Lutz
  • Publication number: 20220195267
    Abstract: The present invention is a toughened one component epoxy adhesive composition demonstrating improved resistance to humidity. Wherein said one-part structural adhesive comprises: A) a blocked PU-polymer toughener compound; B) an epoxy resin component comprising a solid epoxy resin, a liquid epoxy resin, or mixture thereof; C) a curing agent; D) a urea compound; and E) optionally a filler, wherein the blocked PU-polymer toughener (A) is a reaction product of a reaction mixture comprising of: i) a polyether, ii) a hydroxyl-terminated polybutadiene, iii) a polyisocyanate, iv) a chain extender, and v) a capping group.
    Type: Application
    Filed: May 28, 2020
    Publication date: June 23, 2022
    Inventors: ANDREAS LUTZ, DANIEL SCHNEIDER, JEANNINE FLUECKIGER, FELIX KOCH
  • Patent number: 11274236
    Abstract: A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while developing good adhesive and mechanical properties in the cured adhesive.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: March 15, 2022
    Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
    Inventors: Tyler Auvil, Bindu Krishnan, Andreas Lutz, Felix Koch, Cody Clinton
  • Publication number: 20210191110
    Abstract: A device for two-dimensionally scanning beam deflection of a light beam has spectrally tunable light source that emits a light beam having a time-varying wavelength. The device further comprises a first optical component that produces a first beam deflection. The first beam deflection causes the light beam to be deflected wavelength-dependently in a first direction. A second optical component produces a second beam deflection which causes the light beam to be deflected in a second direction different to the first direction. The second optical component comprises a prism pair comprising two prisms that are rotatably arranged successively in a beam path of the light beam. The two prisms are configured to perform continuous counter-rotational movements.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 24, 2021
    Inventors: Frank HÖLLER, Kerstin WINKLER, Felix KOCH
  • Publication number: 20210130663
    Abstract: One-component epoxy adhesives containing a phosphorus-modified epoxy resin, a toughener and an epoxy resin that is neither rubber-modified nor phosphorus-modified. These adhesives are structural adhesives useful in automotive applications. They exhibit particularly good corrosion resistance.
    Type: Application
    Filed: July 20, 2018
    Publication date: May 6, 2021
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Felix Koch, Andreas Lutz, Cathy Grossnickel, Jeannine Flueckiger
  • Publication number: 20210071054
    Abstract: Disclosed are polyurethane adhesive compositions which include (a) one or more urethane prepolymers having isocyanate moieties; (b) a catalytic amount of one or more catalysts; (c) one or more forms of carbon black; (d) one or more calcium carbonates; and (e) one or more silane adhesion promoters.
    Type: Application
    Filed: December 11, 2018
    Publication date: March 11, 2021
    Inventors: Dietmar Golombowski, Felix Koch
  • Publication number: 20210062054
    Abstract: Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles. The one-component epoxy resin adhesive compositions exhibit improved toughness of the adhesive as measured by its lap shear strength as well as improved environmental stability, i.e., corrosion protection, by addition of the zinc oxide nanoparticles when applied to metal substrates.
    Type: Application
    Filed: December 7, 2018
    Publication date: March 4, 2021
    Inventors: FELIX KOCH, ANDREAS LUTZ, BEDA STEINER, CATHY GROSSNICKEL, JEANNINE FLUECKIGER
  • Publication number: 20210009871
    Abstract: One-component toughened epoxy structural adhesives contain fibrous mineral fillers that have an aspect ratio of ?6. The presence of the fibrous filler leads to a significant increase in elastic modulus while having little if any adverse effect on other properties such as dynamic impact peel resistance.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Inventors: FELIX KOCH, SERGIO GRUNDER, ANDREAS LUTZ
  • Publication number: 20200231849
    Abstract: An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 800 Pa s at a temperature of 15° C.; and wherein the viscosity of the above liquid resin system is greater than about 5 Pa-s at a temperature of 60° C.; (II) a solid material comprising: (c) at least one hydrophobic fumed silica, wherein the fumed silica is present in the adhesive composition at a concentration of greater than 5 weight percent; and (III) a curative material comprising: (d) at least one latent heat-activated curing agent; wherein the rheology of the epoxy-based crash durable adhesive composition is such that the adhesive composition is pumpable at a temperature of 15° C.
    Type: Application
    Filed: October 2, 2018
    Publication date: July 23, 2020
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Tyler Auvil, Gary L. Jialanella, Eric E. Cole, Felix Koch, Andreas Lutz, Daniel Schneider
  • Publication number: 20190352549
    Abstract: A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while developing good adhesive and mechanical properties in the cured adhesive.
    Type: Application
    Filed: February 19, 2018
    Publication date: November 21, 2019
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Tyler Auvil, Bindu Krishnan, Andreas Lutz, Felix Koch, Cody Clinton
  • Patent number: 10392542
    Abstract: Disclosed are latent two-part polyurethane adhesives that rapidly develop adhesive strength when cured by application of infrared radiation containing a polyol component which includes; one or more polyols having a hydroxyl equivalent weight of 400 to 2000 and a nominal hydroxyl functionality of 2 to 3; one or more aliphatic diol chain extenders; one or more latent room temperature organometallic catalysts; and one or more multifunctional polyols having a functionality of greater than 3; b) a polyisocyanate component containing one or more polyisocyanate compounds; and v) a carboxylic acid-blocked cyclic amidine compound, vi) a phenol-blocked cyclic amidine compound or both of v) one or more carboxylic acid-blocked cyclic amidine compounds and vi) one or more phenol-blocked cyclic amidine compounds which may be located in the polyol component or the isocyanate component. Further disclosed are methods of bonding structures together using the latent two-part polyurethane adhesives.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: August 27, 2019
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Stefan Schmatloch, Joel Kunz, Grunder Sergio, Felix Koch
  • Patent number: 10233326
    Abstract: The present invention relates to a polyamide moulding compound which consists of a blend of two specific polyamides. The first polyamide is thereby based substantially on 1,5-pentanediamine as diamine component used during polycondensation. The second polyamide is thereby polyamide 6I/6T. The polyamide moulding compounds according to the invention are distinguished by extremely low shrinkage and low differential shrinkage (difference between shrinkage of the moulded article longitudinally and transversely relative to the injection flow). In addition, the present invention relates to moulded articles which are producible from the polyamide moulding compounds according to the invention and also to purposes of use of the polyamide moulding compounds.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: March 19, 2019
    Assignee: EMS-PATENT AG
    Inventors: Felix Koch, Botho Hoffmann