Abstract: Various embodiments of the present disclosure are directed towards a semiconductor package comprising optically coupled integrated circuit (IC) chips. A first IC chip and a second IC chip overlie a substrate at a center of the substrate. A photonic chip overlies the first and second IC chips and is electrically coupled to the second IC chip. A laser device chip overlies the substrate, adjacent to the photonic chip and the second IC chip, at a periphery of the substrate. The photonic chip is configured to modulate a laser beam from the laser device chip in accordance with an electrical signal from the second IC chip and to provide the modulated laser beam to the first IC chip. This facilitates optical communication between the first IC chip to the second IC chip. Various embodiments of the present disclosure are further directed towards simultaneously aligning and bonding constituents of the semiconductor package.

Abstract: Methods and systems are described for proximity condition detection of a recovery from sensor proximity saturation caused by water immersion of a user device. The device transmits data at a first transmit power level using an antenna. In one system, a proximity condition checker determines that a first proximity sensor and a second proximity sensor are saturated in an unknown state after a power event where the saturation caused at least in part by the presence of water in proximity to the first proximity sensor and the second proximity sensor. The proximity condition checker determines that 1) both the first proximity sensor and the second proximity sensor are no longer saturated and 2) water is no longer in proximity to the first proximity sensor and the second proximity sensor. In response, the user device can transmit data at an increased second transmit power level using the antenna.

Abstract: In an implementation, an electronic device may obtain a configuration file from a device provider. The configuration file may include settings of a number of communications providers for communicating over a wireless wide area network. A subscriber identification module (SIM) card may include information, such as a communications provider identifier, that is utilized to determine the settings for a modem of the electronic device. Configuring the modem of the electronic device according to the settings may cause the modem to communicate over the wireless wide area network according to specifications of a particular communications provider of the plurality of communications providers.

Abstract: Techniques are described for dynamically tuning mobile device antennas. Input derived from multiple sources and representing a variety of scenarios is provided to the RF modem of a mobile device. The modem is configured to select antenna tuning settings based on this input, each of which tunes the antenna by modifying its impedance as appropriate for the corresponding scenario.

Abstract: In an implementation, an electronic device may obtain a configuration file from a device provider. The configuration file may include settings of a number of communications providers for communicating over a wireless wide area network. A subscriber identification module (SIM) card may include information, such as a communications provider identifier, that is utilized to determine the settings for a modem of the electronic device. Configuring the modem of the electronic device according to the settings may cause the modem to communicate over the wireless wide area network according to specifications of a particular communications provider of the plurality of communications providers.