Patents by Inventor Felix Liu

Felix Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12235490
    Abstract: A semiconductor structure includes a waveguide and an optical attenuator. The waveguide is disposed over an insulating layer and configured to guide light. The optical attenuator is connected to the waveguide. The optical attenuator has a first surface and a second surface opposite the first surface, and a cross-sectional width of the optical attenuator decreases from the first surface to the second surface.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wei-Kang Liu, Lee-Shian Jeng, Chih-Tsung Shih, Hau-Yan Lu, Yingkit Felix Tsui
  • Publication number: 20250049908
    Abstract: Provided are HIV-1 fusion polypeptides, polynucleotides encoding such fusion polypeptides, vectors expressing such fusion polypeptides for use in eliciting an immune response against HIV-1; pharmaceutical and immunogenic compositions and kits comprising such fusion polypeptides, polynucleotides or vectors, and methods of use in treating and/or preventing HIV-1. Further provided are methods for design of antiviral vaccines, including vaccines to elicit an immune response against HIV-1.
    Type: Application
    Filed: June 14, 2024
    Publication date: February 13, 2025
    Inventors: Jiani Li, Xinan Liu, Azure T. Makadzange, Stephen R. Martin, Sarah Schmidt, Hesham Shehata, Felix Stemeseder, Evguenia Svarovskaia, Archana V. Boopathy
  • Publication number: 20250044518
    Abstract: An edge coupler includes a substrate, a first cladding layer over the substrate, a core layer over the first cladding layer, and an ARC layer. The substrate has a first sidewall, the first cladding layer has a second sidewall aligned with the first sidewall, and the core layer has a third sidewall aligned with the second sidewall. The ARC layer lines the first sidewall, the second sidewall and the third sidewall. The ARC layer physically contacts and covers a surface of the substrate. A first height of the ARC layer varies along the surface of the substrate.
    Type: Application
    Filed: October 22, 2024
    Publication date: February 6, 2025
    Inventors: WEI-KANG LIU, CHIH-TSUNG SHIH, HAU-YAN LU, YINGKIT FELIX TSUI
  • Patent number: 10467438
    Abstract: Methods and systems are described for proximity condition detection of a recovery from sensor proximity saturation caused by water immersion of a user device. The device transmits data at a first transmit power level using an antenna. In one system, a proximity condition checker determines that a first proximity sensor and a second proximity sensor are saturated in an unknown state after a power event where the saturation caused at least in part by the presence of water in proximity to the first proximity sensor and the second proximity sensor. The proximity condition checker determines that 1) both the first proximity sensor and the second proximity sensor are no longer saturated and 2) water is no longer in proximity to the first proximity sensor and the second proximity sensor. In response, the user device can transmit data at an increased second transmit power level using the antenna.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: November 5, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Peter Eli Renner, Ruomeng Yu, Ming Zheng, Serkan Hatipoglu, Felix Liu, Han Seob Choi, Mudit Sunilkumar Khasgiwala
  • Patent number: 9571339
    Abstract: In an implementation, an electronic device may obtain a configuration file from a device provider. The configuration file may include settings of a number of communications providers for communicating over a wireless wide area network. A subscriber identification module (SIM) card may include information, such as a communications provider identifier, that is utilized to determine the settings for a modem of the electronic device. Configuring the modem of the electronic device according to the settings may cause the modem to communicate over the wireless wide area network according to specifications of a particular communications provider of the plurality of communications providers.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: February 14, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Kiran Kumar Edara, Sandeep Rai, Felix Liu, Evan Duke Jeng
  • Patent number: 9407297
    Abstract: Techniques are described for dynamically tuning mobile device antennas. Input derived from multiple sources and representing a variety of scenarios is provided to the RF modem of a mobile device. The modem is configured to select antenna tuning settings based on this input, each of which tunes the antenna by modifying its impedance as appropriate for the corresponding scenario.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: August 2, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: Jay Praful Desai, Anuj Dron, Amit Shailesh Gaikwad, Felix Liu, Pratik Kalpesh Patel
  • Publication number: 20160127176
    Abstract: In an implementation, an electronic device may obtain a configuration file from a device provider. The configuration file may include settings of a number of communications providers for communicating over a wireless wide area network. A subscriber identification module (SIM) card may include information, such as a communications provider identifier, that is utilized to determine the settings for a modem of the electronic device. Configuring the modem of the electronic device according to the settings may cause the modem to communicate over the wireless wide area network according to specifications of a particular communications provider of the plurality of communications providers.
    Type: Application
    Filed: October 30, 2014
    Publication date: May 5, 2016
    Inventors: Kiran Kumar Edara, Sandeep Rai, Felix Liu, Evan Duke Jeng