Abstract: A hand held plating applicator for electroplating a relatively soft metal onto a substrate consisting of an anode composed of the relatively soft metal, an electrically insulating handle, and a backing composed of a metal substantially harder than the relatively soft metal. The backing is secured to the handle, and has a plurality of countersunk apertures therein, the soft anode having integral protuberances which extend through the apertures and hold the anode in firm contact with one face of the backing. The protuberances are flattened at their ends to fill up the countersunk portions of the apertures, and provide surfaces which are flush with the opposite face of the backing.

Abstract: An improved method and composition for plating a workpiece with tin, cadmium, lead, or indium which involves first applying an aqueous electrolyte to the substrate with a rubbing action and without electroplating voltage being applied and then applying the electroplating voltage to an anode composed of one of the aforementioned metals, utilizing the same aqueous electrolyte to plate metal from the anode onto the substrate. The aqueous electrolyte contains dissolved free sulfamic acid in concentrations up to saturation, and the electrolyte is substantially devoid of ions of a plateable metal. The electrolyte preferably includes a small amount of a surface active wetting agent.

Abstract: An improved method of plating a workpiece with brass or copper which involves first applying an aqueous solution containing Rochelle salt, an alkali metal carbonate, and a surfactant to the workpiece without electrical current being applied, and thereafter rubbing the same solution into the workpiece while applying an electroplating current between a brass or copper anode and the workpiece. The invention is also concerned with the compositions used as electrolytes in this process.