Abstract: A chamber body includes a ceramic weldment. The ceramic weldment has an upper wall, a sidewall, a lower wall, and a lower wall rib segment. The sidewall is coupled to the upper wall by a sidewall-to-upper wall weld, the lower wall coupled to the sidewall by a sidewall-to-lower wall weld and defining a passthrough, and the lower wall rib segment is coupled to the lower wall plate by a lower wall rib segment weld. The upper wall has an upper wall plate portion and an upper wall rib portion through that define an upper wall unwelded ribbed region, overlay the passthrough, and which is formed using a singular ceramic workpiece using a subtractive manufacturing technique. Chamber arrangements, semiconductor processing systems, and methods of making ceramic weldments are also described.

Abstract: A chamber body includes a ceramic weldment having an upper wall, a sidewall, and a lower wall. The upper wall is coupled to the sidewall by a sidewall-to-upper wall weld and includes an upper wall rib segment coupled to an upper wall plate by an upper wall rib segment weld. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld. The lower wall has a lower wall plate portion and a lower wall rib portion extending therefrom both formed from a singular ceramic workpiece using a subtractive manufacturing technique, the lower wall plate portion thereby defining a lower wall unwelded ribbed region including a plurality of lower wall rib segments defined by the lower wall rib portion of the lower wall. Chamber arrangements, semiconductor processing systems, and methods of making ceramic weldments for chamber bodies in chamber arrangement and semiconductor processing systems are also described.

Abstract: A chamber body includes a ceramic weldment having a lower wall, a sidewall, and an upper wall. The sidewall is coupled to the lower wall by a sidewall-to-lower wall weld and the upper wall is coupled to the sidewall by a sidewall-to-upper wall weld. The upper wall has an upper wall plate portion and an upper wall rib portion extending therefrom formed from a singular quartz workpiece using a subtractive manufacturing technique, the upper wall further having a unwelded ribbed region overlying the lower wall. Chamber arrangements, semiconductor processing systems and related methods of making chamber bodies and depositing material layers onto substrates supported within chamber bodies are also described.

Abstract: A shaft member includes a cylindrical body formed from a ceramic material and having a drive segment, a frustoconical segment, and an end key segment. The drive segment extends about a rotation axis, the frustoconical segment is offset from the drive segment along the rotation axis, and the end key segment extends axially from the frustoconical segment and is axially separated from the drive segment by the frustoconical segment of the shaft member. The end key segment has a first circumferential facet and a second circumferential facet circumferentially opposite the first circumferential facet to fix the shaft member in rotation about the rotation axis relative to a support member seated when the end key segment is slidably received within an end key socket defined within the support member. Process kits, semiconductor processing systems, and methods of making semiconductor processing systems are also described.

Abstract: A substrate handling chamber body is formed from a castable aluminum alloy including a manganese (Mn) constituent and an iron (Fe) constituent. The castable aluminum alloy has a manganese (Mn) constituent-to-iron (Fe) constituent ratio that between about 1.125 and about 1.525 to limit microporosity and shrinkage porosity within the castable aluminum alloy forming the substrate handling chamber body. Semiconductor processing systems and methods of making substrate handling chamber bodies for semiconductor processing systems are also described.

Abstract: Embodiments of an apparatus for gas delivery in a semiconductor processing system use a gas distribution plate that has a plurality of gas passageways where the passageways have surfaces with an average roughness of less than or equal to approximately 10 Ra. In some embodiments, the gas distribution plate has one or more internal fluid passageways that are capable of being fluidly coupled to one or more fluid sources to provide temperature control of the gas distribution plate. In some embodiments, the gas distribution plate has at least one internal cavity with at least one heatsink that may surround at least one of the plurality of gas passageways to provide, at least partial, temperature control of the gas distribution plate.

Abstract: Embodiments of an apparatus for gas delivery in a semiconductor processing system use a gas distribution plate that has a plurality of gas passageways where the passageways have surfaces with an average roughness of less than or equal to approximately 10 Ra. In some embodiments, the gas distribution plate has one or more internal fluid passageways that are capable of being fluidly coupled to one or more fluid sources to provide temperature control of the gas distribution plate. In some embodiments, the gas distribution plate has at least one internal cavity with at least one heatsink that may surround at least one of the plurality of gas passageways to provide, at least partial, temperature control of the gas distribution plate.

Abstract: In a first aspect, a method for cleaning a semiconductor fabrication chamber component having an orifice is provided. The method includes (A) placing the component into a bath having a cleaning solution; (B) flowing a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component; and (C) withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice. Numerous other aspects are also provided.

Abstract: A method for manufacturing a faceplate of a semiconductor apparatus is provided. The method includes selecting a size of a tool in response to a predetermined specification of a predetermined gas parameter. The tool is used to form the holes within the faceplate. A first gas parameter of the holes of the faceplate is measured by an apparatus to determine if the measured first gas parameter of the holes of the faceplate is within the predetermined specification.

Abstract: In a first aspect, a method for cleaning a semiconductor fabrication chamber component having an orifice is provided. The method includes (A) placing the component into a bath having a cleaning solution; (B) flowing a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component; and (C) withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice. Numerous other aspects are also provided.

Abstract: Method for producing a coated medical support device capable of insertion into the body, the method including the procedures of applying a coating to a section of a work-piece, positioning the work-piece in the vicinity of an electromagnetic field generator, and substantially proximate a forming mandrel, inducing electromagnetic forces in the work-piece which accelerate the work-piece toward the forming mandrel, and forming the work-piece to a medical support device, by changing the original physical configuration of the work-piece to a second physical configuration, the forming mandrel having a mandrel physical configuration, the second physical configuration being influenced by the mandrel physical configuration.

Abstract: Method for producing a coated medical support device capable of insertion into the body, the method including the procedures of applying a coating to a section of a work-piece, positioning the work-piece in the vicinity of an electromagnetic field generator, and substantially proximate a forming mandrel, inducing electromagnetic forces in the work-piece which accelerate the work-piece toward the forming mandrel, and forming the work-piece to a medical support device, by changing the original physical configuration of the work-piece to a second physical configuration, the forming mandrel having a mandrel physical configuration, the second physical configuration being influenced by the mandrel physical configuration.

Abstract: Method for producing a coated medical support device capable of insertion into the body, the method including the procedures of applying a coating to a section of a work-piece, positioning the work-piece in the vicinity of an electromagnetic field generator, and substantially proximate a forming mandrel, inducing electromagnetic forces in the work-piece which accelerate the work-piece toward the forming mandrel, and forming the work-piece to a medical support device, by changing the original physical configuration of the work-piece to a second physical configuration, the forming mandrel having a mandrel physical configuration, the second physical configuration being influenced by the mandrel physical configuration.

Abstract: Method for producing a medical support device from an object, using an electromagnetic field generator, whereby the method comprises of the steps of placing a formation mandrel against the object, close to a predetermined formation area, and applying the electromagnetic field to the formation area, thereby forming the object. The produced object can be made from a tubular segment, a folded sheet of material or a plurality of wires joined together.

Abstract: Method for producing a medical support device from an object, using an electromagnetic field generator, whereby the method comprises of the steps of placing a formation mandrel against the object, close to a predetermined formation area, and applying the electromagnetic field to the formation area, thereby forming the object. The produced object can be made from a tubular segment, a folded sheet of material or a plurality of wires joined together.

Abstract: System and method for opening and temporarily supporting a section of a generally tubular organ, the system includes a dilation catheter, the dilation catheter includes an integrally connected shape memory catheter tip, the shape memory catheter tip, is made of a shape memory alloy, wherein said shape memory catheter tip assumes a first shape at a first temperature and a second shape at a second temperature.

Abstract: There is provided a system for opening and temporarily supporting a section of a generally tubular organ. The system includes a dilation catheter which has an integrally connected shape memory catheter tip. The shape memory catheter tip is made of a shape memory alloy. The shape memory catheter tip assumes a first shape at a first temperature and a second shape at a second temperature. Accordingly, the shape memory catheter tip is inserted into the body of the patient, while being in a narrow shape and expands within the body of the patient.

Abstract: System for opening and temporarily supporting a section of a generally tubular organ, the system comprising a dilation catheter, and an inflatable balloon, the dilation catheter includes an integrally connected shape memory catheter tip, the shape memory catheter tip, is made of a shape memory alloy, the balloon being inserted within said shape memory catheter tip, wherein the balloon is operative to inflate, thereby moving the shape memory catheter tip from a first shape into a second shape, and wherein the shape memory catheter tip changes from the second shape to the first shape when heated from a first temperature to a second temperature.