Patents by Inventor Felix Schinner

Felix Schinner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integration of SMD components in an IC housing
    Patent number: 8203168
    Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: June 19, 2012
    Assignee: Micronas GmbH
    Inventors: Felix Schinner, Christian Joos, Wolfgang Hauser, Michael Schmidt, Thomas Burke
  • INTEGRATION OF SMD COMPONENTS IN AN IC HOUSING
    Publication number: 20110068460
    Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.
    Type: Application
    Filed: September 22, 2010
    Publication date: March 24, 2011
    Inventors: Felix SCHINNER, Christian Joos, Wolfgang Hauser, Michael Schmidt, Thomas Burke