Abstract: The present disclosure relates to a food processor for performing a food preparation process by heating, chopping and/or stirring a food in a food preparation vessel by means of a heating element for heating and/or a rotatable tool for chopping and/or stirring the food in the food preparation vessel, wherein the food processor comprises at least one functional unit including a motor for rotating the tool and/or the heating element for heating, wherein the food processor comprises at least one device for limiting a degree of freedom of a user during use of the food processor for food preparation including at least one motor-driven locking device for the food preparation vessel or its lid.

Abstract: A microvalve for controlling fluid flows, and a sealing device for sealing cavities in a microfluidic system, particularly in a lab-on-a-chip system, and a method for the production thereof. A sealing surface of a valve body, or a sealing element, respectively, rests on a sealing surface of a substrate and is pressed against the sealing surface of the substrate in a fluid-tight manner by means of a clamping element. The clamping element and/or the valve body, or the sealing element, respectively, are at least partially elastic.

Abstract: A microvalve for controlling fluid flows, and a sealing device for sealing cavities in a microfluidic system, particularly in a lab-on-a-chip system, and a method for the production thereof. A sealing surface of a valve body, or a sealing element, respectively, rests on a sealing surface of a substrate and is pressed against the sealing surface of the substrate in a fluid-tight manner by means of a clamping element. The clamping element and/or the valve body, or the sealing element, respectively, are at least partially elastic.

Abstract: A method for producing a rocker pressure member forming part of a chain hinge joint for a plate-link chain. A shaped wire is embossed along at least a predetermined segment in the longitudinal direction, and then a separation is made at that segment. A stamping apparatus for producing a rocker pressure member from a shaped wire is provided, with a housing which includes a lower housing half as a die and an upper housing half to guide at least one stamping die for embossing the shaped wire.

Abstract: The invention relates to an assembly device for microcomponents that are disposed in a magazine. The inventive assembly device does not require any optical systems and allows for an exact positioning of the microcomponents. The assembly will also be unaffected by any position changes of the microcomponents caused by wastage. The assembly device is provided with mechanical alignment devices that engage with or act upon adjustment structures of the magazine. The assembly device further comprises clamping devices for fixing the magazine and at least one plunger for ejecting at least one microcomponent from the magazine. An assembly platform is provided in the upper tool or in the lower tool of the assembly device and receives the microcomponents in a defined position. The invention further relates to a method for assembling microcomponents and to a corresponding magazine.

Abstract: The invention relates to a flat coil and to a lthographic method for producing microcomponents with metal component sources in the sub-millimeter range. According to the inventive method, a resist material is structured by means of selective exposition and removing the unexposed zones and filling in the gaps between the resist structures with metal by means of a galvanic method to produe the metal component structures. The aim of the invention is to improve such a method so that the microcomponents can be subdivided during said process. To this end, a structured three-dimensional sacrificial metal layer is produced during the production of the microcomponent, said sacrificial layer delimiting the microcomponent and being removed once the microcomponent is due to be subdivided.

Abstract: The invention relates to a lithographic method for producing microcomponents with component structures in the submillimeter range. According to the inventive method, a structured adhesive layer is applied to a metal layer and then a photostructured epoxy resin layer is applied to said adhesive layer. Said epoxide resin is structured by means of selective exposition and removing the unexposed zones and filling in the gaps between the resin structures with metal by electroplating. The aim of the invention is to provide an adhesive layer that is suitable for photostructured epoxy resins, especially for SU-8 resist material and that prevents the resist material from being detached. To this end, the adhesive layer consists of polyimide or a polyimide mixture.

Abstract: The invention relates to an assembly device for microcomponents that are disposed in a magazine. The inventive assembly device does not require any optical systems and allows for an exact positioning of the microcomponents. The assembly will also be unaffected by any position changes of the microcomponents casued by wastage. The assembly device is provided with mechanical alignment devices that engage with or act upon adjustment structures (42a-d, 44a-d, 45a-d) of the magazine (4). The assembly device further comprises clamping devices for fixing the magazine and at least one plunger (2a, b) for ejecting at least one microcomponent (3a, b) from the magazine (4). An assembly platform (8) is provided in the upper tool (101) or in the lower tool (102) of the assembly device and receives the microcomponents in a defined position. The invention further relates to a method for assembling microcomponents and to a corresponding magazine.