Patents by Inventor Fen-Ren Chen

Fen-Ren Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die attachment method for LED chip and structure thereof
    Publication number: 20070141749
    Abstract: A die attachment method for LED chips and the structure thereof are disclosed. While attaching a LED chip to a substrate, surface of two bonding material is ionized by ultrasonic waves so as to make the attachment of a LED chip to a substrate is under low temperature operating condition and having better heat dissipation structure.
    Type: Application
    Filed: December 20, 2005
    Publication date: June 21, 2007
    Inventors: Yi-Fong Lin, Shyi-Ming Pan, Way-Jze Wen, Fen-Ren Chen