Abstract: A semiconductor package includes an insulation layer provided between a molding compound and an electromagnetic interface (EMI) layer. The insulation layer covers an exposed portion of a bond wire that extends beyond a top surface of the molding compound due to a Z-height reduction of the molding compound. The insulation layer prevents a short from occurring between the bond wire and the EMI layer.

Abstract: A memory device includes a substrate, a controller die attached to the substrate, and a memory die stack. The memory die stack includes a first silicon die having a first contact pad surface and a bottom surface attached to the substrate. The memory die stack includes a second silicon die stacked on the first silicon die, the second silicon die including a second contact pad surface. An overhang portion of the second silicon die extends beyond the first silicon die. The memory die stack includes a printed support structure attached to the substrate, the printed support structure supporting the overhang portion of the second silicon die, and one or more bond wires that electrically connect the first and second contact pad surfaces to the substrate, thereby electrically connecting the first and second silicon dies to the controller die by way of the substrate.

Abstract: A method of forming a semiconductor device includes forming vertical contact fingers in a substrate having side portions that are flexible. Contact fingers are formed near one or more edges of the flexible side portions of the substrate. After semiconductor dies are mounted to and electrically coupled to the substrate, the semiconductor device may be encapsulated by placing the device in a mold chase including upper and lower mold plates. The lower mold plate is sized smaller than the substrate so that the flexible side portions of the substrate including the contact fingers fold vertically upward to fit within the mold.

Abstract: A thickness of a signal trace on a printed circuit board (PCB) or a substrate is increased by intentionally forming a solder bridge on a surface of the signal trace during a reflow process in which a flip chip die or other computing component is mounted to the PCB or the substrate. Specifically, adjacent interconnects of the flip chip die are coupled to the same signal trace on the PCB or the substrate. During the reflow process, solder associated with each interconnect flows into a space or area defined by the adjacent interconnects and forms a solder bridge within the space, thereby increasing a thickness of the signal trace.

Abstract: A semiconductor memory package includes a substrate, a first stack of memory dies, and a second stack of memory dies. The first stack of memory dies includes a first substack of staggered memory dies offset with respect to each other in a first direction and a second substack of staggered memory dies offset with respect to each other in the first direction and positioned above the first substack. The second stack of memory dies includes a third substack of staggered memory dies offset with respect to each other in a second direction and a fourth substack of staggered memory dies offset with respect to each other in the second direction and positioned above the third substack. The top memory die of the first substack and a memory die positioned below the top memory die of the third substack are at least partially coplanar.

Abstract: A method and apparatus for substrate component layout and bonding for increased package capacity. According to certain embodiments, a wire-bonding finger strip is disposed between a flip-chip die and a NAND die stack to reduce a keep out zone (KOZ) required for an underfill material dispensed beneath the flip-chip die. To further inhibit the flow of the underfill material and further reduce the KOZ, a solder mask may be placed adjacent to the flip-chip. According to certain embodiments, there may be at least three sides of the flip-chip that may have such an adjacent solder mask placement. The three sides of the flip-chip according to such embodiments may be those non-adjacent to the wire-bonding finger strip.

Abstract: A semiconductor device has shielding to prevent transmission and/or reception of EMI and/or RFI radiation. The semiconductor device comprises a substrate including grounded contact pads around a periphery of the substrate, exposed at one or more edges of the substrate. A bump made of gold or other non-oxidizing conductive material may be formed on the contact pads, for example using ultrasonic welding to remove an oxidation layer between the contact pads and the conductive bumps. The conductive bumps electrically couple to a conductive coating applied around the periphery of the semiconductor device.

Abstract: A semiconductor device package includes a semiconductor die including bond pads and an underfill inlet side, a substrate including a first metal layer and lower metal layers underneath the first metal layer, a plurality of metal contacts and trace segment lines disposed in the first metal layer, and a plurality of solder bump rows. Each of the solder bump rows is oriented substantially parallel to the inlet side of the semiconductor die and electrically connects bond pads of the semiconductor die with corresponding metal contacts in the first metal layer of the substrate. Each of the trace segment lines is oriented substantially parallel to the inlet side of the semiconductor die, is electrically coupled to a respective solder bump row of the plurality of solder bump rows, and includes trace segments disposed in the first metal layer and trace segments disposed in one or more of the lower metal layers.

Abstract: A semiconductor memory package includes a substrate, a first stack of memory dies, and a second stack of memory dies. The first stack of memory dies includes a first substack of staggered memory dies offset with respect to each other in a first direction and a second substack of staggered memory dies offset with respect to each other in the first direction and positioned above the first substack. The second stack of memory dies includes a third substack of staggered memory dies offset with respect to each other in a second direction and a fourth substack of staggered memory dies offset with respect to each other in the second direction and positioned above the third substack. The top memory die of the first substack and a memory die positioned below the top memory die of the third substack are at least partially coplanar.

Abstract: A semiconductor device has shielding to prevent transmission and/or reception of EMI and/or RFI radiation. The semiconductor device comprises a substrate including grounded contact pads around a periphery of the substrate, exposed at one or more edges of the substrate. A bump made of gold or other non-oxidizing conductive material may be formed on the contact pads, for example using ultrasonic welding to remove an oxidation layer between the contact pads and the conductive bumps. The conductive bumps electrically couple to a conductive coating applied around the periphery of the semiconductor device.

Abstract: A semiconductor device has vertical contact fingers formed in a substrate having side portions that are flexible. Contact fingers are formed near one or more edges of the flexible side portions of the substrate. After semiconductor dies are mounted to and electrically coupled to the substrate, the semiconductor device may be encapsulated by placing the device in a mold chase including upper and lower mold plates. The lower mold plate is sized smaller than the substrate so that the flexible side portions of the substrate including the contact fingers fold vertically upward to fit within the mold.

Abstract: A method and apparatus for substrate component layout and bonding for increased package capacity. According to certain embodiments, a wire-bonding finger strip is disposed between a flip-chip die and a NAND die stack to reduce a keep out zone (KOZ) required for an underfill material dispensed beneath the flip-chip die. To further inhibit the flow of the underfill material and further reduce the KOZ, a solder mask may be placed adjacent to the flip-chip. According to certain embodiments, there may be at least three sides of the flip-chip that may have such an adjacent solder mask placement. The three sides of the flip-chip according to such embodiments may be those non-adjacent to the wire-bonding finger strip.

Abstract: A semiconductor device package includes a substrate, a heat-generating component positioned on a surface of the substrate, and an encapsulant at least partially covering the heat-generating component and having an outer surface. A first heat-conducting layer is disposed between the encapsulant and the first heat-generating component. One or more pillars are in contact with the first heat-conducting layer and extend to the outer surface of the encapsulant and contact a second heat-conducting layer disposed on the outer surface of the encapsulant.

Abstract: A semiconductor device package includes a substrate, a heat-generating component positioned on a surface of the substrate, and an encapsulant at least partially covering the heat-generating component and having an outer surface. A first heat-conducting layer is disposed between the encapsulant and the first heat-generating component. One or more pillars are in contact with the first heat-conducting layer and extend to the outer surface of the encapsulant and contact a second heat-conducting layer disposed on the outer surface of the encapsulant.

Abstract: A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.

Abstract: A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.

Abstract: Disclosed is a method for making an antimicrobial material from 1D nanometer silver that does not accumulate in a human body. At first, 1D nanometer silver is mixed in hydrophilic solution to produce 1D nanometer silver solution. Then, adhesive is blended in the 1D nanometer silver solution to produce the antimicrobial material. The antimicrobial material may be used in antimicrobial liquid, antimicrobial dressing or antimicrobial composite. Human skin can easily block the 1D nanometer silver. Therefore, the 1D nanometer silver does not enter or accumulate in the human body. Yet, the antimicrobial material exhibits a high bactericidal rate.

Abstract: A portable diagnostic device for cervical precancerous lesions is disclosed. The device includes an inherent fluorescence detection system for cervical cancer, a cervix acetic acid coloring detection and an image collection system. The inherent fluorescence detection system for cervical cancer has a light source and a switch, which consists of a excitation light source that generates fluorescence and a cold light source that generates white light, both the excitation light source and the cold light source are installed in the bowl-shaped reflector with specific focal length. The cervix acetic acid coloring detection system has an acetic acid pool, a spraying tube that connects with the acetic acid pool, a spraying tube moving device, and a spraying switch. The image collection system has a weak light CCD, which is installed in the center of the bowl-shaped reflector.

Abstract: An architecture for development and execution of a system for implementing business logic includes an engine providing management of the system and execution of the business logic. A single service-side interface connects the engine to service side plug-in modules, and a single resource side interface connects the engine with resource-side plug-in modules. The server-side and resource-side plug-in modules connect to users and resources, respectively. The single interfaces conform the plug-in module interfaces to one interface to communicate with the engine. The single interfaces employ a single command definition. Development code defining the business logic is written by a user and executed by the engine.

Abstract: A handle structure includes a gripping portion and a hinge portion. The gripping portion includes a handle and two levers. Each lever has a first hole, a second hole and a groove adjacent to the second hole. The handle is inserted into those second holes by pressing the handle toward the grooves. The hinge portion includes two flexible clamps. Each flexible clamp includes two protrusions against each other. The end with the first hole of the gripping portion presses the two protrusions to move apart from each other. Then, the protrusions are inserted in the first holes, and the gripping portion can swing around the hinge portion.