Abstract: The present disclosure provides an apparatus and a method for transferring a wafer, and an apparatus for controlling transferring a wafer. The apparatus for transferring a wafer includes a transfer chamber, at least one process chamber, a first detection unit, and a control unit, wherein the transfer chamber is provided therein with a transfer unit; the at least one process chamber is in connect with the transfer chamber, and a chamber door is provided at a connect position; the first detection unit includes a first transmit end and a first receive end, the first transmit end is provided on one of the transfer unit and the chamber door, and the first transmit end is provided on the other one of the transfer unit and the chamber door.

Abstract: An installation fixture for needle is used to install needles of an electrostatic chuck, and includes: a positioning tray, detachably disposed on an outer base of the electrostatic chuck, the positioning tray being provided with installation holes, and the installation holes corresponding to installation positions of the needles of the electrostatic chuck; and an installation fixture, detachably installed in the installation hole to adjust the installation depth of the needle.

Abstract: The embodiment of the present application discloses a mounting apparatus and a mounting method. The mounting apparatus comprises: a bracket; a tray movably disposed on the bracket, wherein the tray comprises the first bearing portion and the second bearing portion, the second bearing portion is disposed around the circumference of the first bearing portion and coincides with the center of gravity of the first bearing portion, a first sensor, which is disposed at the center of gravity of the first bearing portion and collects the offset of the center of gravity of the supported first upper electrode portion and the second upper electrode portion; and a driving assembly, which is connected to the tray, drives the tray to ascend and descend and drives the tray to adjust the supporting positions of the first upper electrode portion and the second upper electrode portion.

Abstract: An installation fixture for needle is used to install needles of an electrostatic chuck, and includes: a positioning tray, detachably disposed on an outer base of the electrostatic chuck, the positioning tray being provided with installation holes, and the installation holes corresponding to installation positions of the needles of the electrostatic chuck; and an installation fixture, detachably installed in the installation hole to adjust the installation depth of the needle.

Abstract: The present disclosure provides an apparatus and a method for transferring a wafer, and an apparatus for controlling transferring a wafer. The apparatus for transferring a wafer includes a transfer chamber, at least one process chamber, a first detection unit, and a control unit, wherein the transfer chamber is provided therein with a transfer unit; the at least one process chamber is in connect with the transfer chamber, and a chamber door is provided at a connect position; the first detection unit includes a first transmit end and a first receive end, the first transmit end is provided on one of the transfer unit and the chamber door, and the first transmit end is provided on the other one of the transfer unit and the chamber door.

Abstract: A plasma processing apparatus includes an electrostatic chuck, a connection surface being provided at a periphery of the electrostatic chuck; an edge adjustment ring, arranged around the electrostatic chuck in a circumferential direction, an inner wall of the edge adjustment ring being opposite to an outer wall of the electrostatic chuck; and an edge ring, arranged around the electrostatic chuck and above the connection surface, and located above the edge adjustment ring. The edge adjustment ring includes an annular body and an annular protrusion protruding toward the edge ring, and the annular body is relatively close to the electrostatic chuck.

Abstract: The embodiment of the present application discloses a mounting apparatus and a mounting method. The mounting apparatus comprises: a bracket; a tray movably disposed on the bracket, wherein the tray comprises the first bearing portion and the second bearing portion, the second bearing portion is disposed around the circumference of the first bearing portion and coincides with the center of gravity of the first bearing portion, a first sensor, which is disposed at the center of gravity of the first bearing portion and collects the offset of the center of gravity of the supported first upper electrode portion and the second upper electrode portion; and a driving assembly, which is connected to the tray, drives the tray to ascend and descend and drives the tray to adjust the supporting positions of the first upper electrode portion and the second upper electrode portion.

Abstract: The present application discloses a pressure drive system and method, and a semiconductor manufacture apparatus employing the system to perform pressure drive; by importing information of this wafer before a manufacture process initiates, a corresponding safe driving pressure and a corresponding safety threshold for each wafer are acquired and set for pressure control, and an abnormality judgment is performed based on data fed back by a pressure detection module in real time, thereby effectively avoiding a wafer breakage caused when an electrostatic release is abnormal, and the pressures for various wafers under different situations are controllable, and thus, an accuracy of the control is improved; with real-time feedback from the pressure detection module and a pressure regulation module, a wafer breakage, caused when an electrostatic release is abnormal, is effectively avoided.