Abstract: A ceiling-mounted microphone array enclosure includes a room panel and a top panel. The room panel includes a border of solid material that surrounds a central sound permeable area having sound permeable perforations. The top panel is connected to the room panel through connectors arranged along the border of solid material. The top panel can have sides and be connected to the room panel such that there is a gap to permit improved airflow, or sides of the top panel can connect directly to the bottom panel without a gap. A microphone array and other electronic components can be arranged within the enclosure and then ceiling mounted within a ceiling grid. Multiple differently sized room panels can be manufactured in such a way that they can connect directly to the top panel. To reduce manufacturing costs, each of the top panels can be manufactured having the same size and design.