Patents by Inventor Feng Ao

Feng Ao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084237
    Abstract: Disclosed is an apparatus configured to support growth of a 3D, hollow organoid. The apparatus contains a support structure and an enclosure, wherein a number of cells positioned between the support structure and the enclosure can grow on/around the support structure to form the organoid. The support structure additionally contains openings such that a fluid within the structure can flow into the organoid. The support structure may also extend between two fluid reservoirs configured to supply a fluid to the structure and organoid. The entire apparatus may be formed from an additive manufacturing process.
    Type: Application
    Filed: January 13, 2022
    Publication date: March 14, 2024
    Inventors: FENG GUO, ZHENG AO, HONGWEI CAI
  • Patent number: 9214749
    Abstract: A pluggable apparatus of a circuit board is provided, which solves the problem that hot plugging of a Peripheral Component Interconnect Express (PCI-E) card is difficult to implement. The pluggable apparatus of the circuit board includes a base plate, a pulling strip, a rotating member, and a carrier plate, where the pulling strip is movably connected to the base plate by using a transverse guide mechanism, sawteeth are formed on a body of the pulling strip, the pulling strip further includes a handle that extends out of the base plate; the rotating member is in a bending line shape; the carrier plate is movably connected to the base plate by using a longitudinal guide mechanism; and a clamping trough is disposed on the carrier plate and is configured to fasten the circuit board.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: December 15, 2015
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Shuang Li, Yao Li, Feng Ao
  • Publication number: 20150076975
    Abstract: A container data center includes one container body and at least one cabinet set that is arranged in the container body in one direction. Each cabinet set includes at least one cabinet, and a direction in which the at least one cabinet is arranged is perpendicular to the direction in which the cabinet set is arranged. Bottoms of all cabinets in each cabinet set are fastened on one shock absorbing platform, and a bottom of the shock absorbing platform is fastened to a bottom of the container body by using multiple shock absorbers. The container data center can reduce an impact of vibration and a shock on a data center pipe in a transportation process.
    Type: Application
    Filed: November 24, 2014
    Publication date: March 19, 2015
    Inventors: Yonghui Peng, Feng Ao, Dongli Wang
  • Publication number: 20140254086
    Abstract: A pluggable apparatus of a circuit board is provided, which solves the problem that hot plugging of a Peripheral Component Interconnect Express (PCI-E) card is difficult to implement. The pluggable apparatus of the circuit board includes a base plate, a pulling strip, a rotating member, and a carrier plate, where the pulling strip is movably connected to the base plate by using a transverse guide mechanism, sawteeth are formed on a body of the pulling strip, the pulling strip further includes a handle that extends out of the base plate; the rotating member is in a bending line shape; the carrier plate is movably connected to the base plate by using a longitudinal guide mechanism; and a clamping trough is disposed on the carrier plate and is configured to fasten the circuit board.
    Type: Application
    Filed: May 23, 2014
    Publication date: September 11, 2014
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Shuang Li, Yao Li, Feng Ao
  • Publication number: 20140126170
    Abstract: Embodiments of the present invention disclose a backplane, a cabinet-level communication device, and a method for replacing a backplane, related to the field of mobile communication technologies, and can greatly reduce difficulty in replacing a backplane while ensuring stability of a connection between the backplane and a front board or a rear board. The backplane includes: a base plate of a stripe structure; one or more first connectors arranged on a first face of the base plate and configured to connect a corresponding connector on a front board; and one or more second connectors arranged on a second face of the base plate opposite to the first face and configured to connect a corresponding connector on a rear board.
    Type: Application
    Filed: December 31, 2013
    Publication date: May 8, 2014
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Lei Bai, Feng Ao, Fei Luo
  • Patent number: 8226057
    Abstract: In the field of communication technologies, a fixing device for a holding pole is provided, so as to solve the problem of increased mounting cost due to too much manpower occupied by mounting the fixing device for the holding pole. The fixing device for the holding pole includes a first fastener, a second fastener, and a securing member, two ends of the first fastener are radially engaged with two ends of the second fastener to form a ring, and the securing member rotatably runs through the first fastener or the second fastener to reach the inside of the ring.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: July 24, 2012
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Feng Ao, Junwei Pan, Bin Wang, Haiping Chen
  • Publication number: 20110233373
    Abstract: In the field of communication technologies, a fixing device for a holding pole is provided, so as to solve the problem of increased mounting cost due to too much manpower occupied by mounting the fixing device for the holding pole. The fixing device for the holding pole includes a first fastener, a second fastener, and a securing member, two ends of the first fastener are radially engaged with two ends of the second fastener to form a ring, and the securing member rotatably runs through the first fastener or the second fastener to reach the inside of the ring.
    Type: Application
    Filed: June 13, 2011
    Publication date: September 29, 2011
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Feng AO, Junwei PAN, Bin WANG, Haiping CHEN
  • Publication number: 20100040786
    Abstract: A process for sealing micro pores of micro-arc oxide film is disclosed in the present disclosure. The process may comprise the following steps: providing a piece of metal having a micro-arc oxide film; preparing a solution including ethyl silicate to make a sealing agent; dipping the metal in the sealing agent to form a coating on the film's surface.
    Type: Application
    Filed: June 4, 2009
    Publication date: February 18, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: FENG-YUEN DAI, CHWAN-HWA CHIANG, YUNG-TA LO, CHI-CHUANG HO, WEI LIU, XU-FENG AO
  • Publication number: 20100040795
    Abstract: A process for sealing micro pores of micro-arc oxide film is disclosed in the present disclosure. The process may comprise the following steps: providing a metal coated with a micro-arc oxide film; providing a dipping solution including polyester methacrylate monomer for use as a sealing agent; and dipping the metal in the sealing agent to form a coating on the oxide film's surface.
    Type: Application
    Filed: June 4, 2009
    Publication date: February 18, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: FENG-YUEN DAI, CHWAN-HWA CHIANG, YUNG-TA LO, CHI-CHUANG HO, WEI LIU, XU-FENG AO
  • Publication number: 20100040787
    Abstract: A process for sealing micro pores of micro-arc oxide film is disclosed in the present disclosure. The process may comprise the following steps: providing a metal coated with a micro-arc oxide film; blending a silicone resin and a diluting agent to make a sealing agent; daubing the sealing agent onto the micro-arc oxide film to form a coating on the film's surface.
    Type: Application
    Filed: June 4, 2009
    Publication date: February 18, 2010
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: FENG-YUEN DAI, CHWAN-HWA CHIANG, YUNG-TA LO, CHI-CHUANG HO, WEI LIU, XU-FENG AO
  • Publication number: 20090324840
    Abstract: A process for sealing micro pores of micro-arc oxide film is disclosed. The process comprises the following steps: providing a piece of metal formed with a micro-arc oxide film; blending a polyurethane resin and a firming agent to make a sealing agent; spraying the sealing agent onto the micro-arc oxide film to form a coating on the film's surface. The process can also be: blending an epoxy resin and a firming agent to make a sealing agent to sealing the micro pores by spraying.
    Type: Application
    Filed: June 4, 2009
    Publication date: December 31, 2009
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: FENG-YUEN DAI, YUNG-TA LO, CHI-CHUANG HO, WEI LIU, XU-FENG AO
  • Publication number: 20090258234
    Abstract: A housing includes a plastic substrate, a transparent plastic film, and an intermediate layer sandwiched between the plastic substrate and the transparent plastic film. The intermediate layer includes a metallic coating formed on the transparent film and a protective coating formed on and covering the metallic coating. The plastic substrate is moldingly attached to the protective coating.
    Type: Application
    Filed: April 7, 2009
    Publication date: October 15, 2009
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: CHWAN-HWA CHIANG, YUNG-TA LO, TAO GONG, XU-FENG AO, FENG-YUEN DAI