Patents by Inventor Feng Ao
Feng Ao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084237Abstract: Disclosed is an apparatus configured to support growth of a 3D, hollow organoid. The apparatus contains a support structure and an enclosure, wherein a number of cells positioned between the support structure and the enclosure can grow on/around the support structure to form the organoid. The support structure additionally contains openings such that a fluid within the structure can flow into the organoid. The support structure may also extend between two fluid reservoirs configured to supply a fluid to the structure and organoid. The entire apparatus may be formed from an additive manufacturing process.Type: ApplicationFiled: January 13, 2022Publication date: March 14, 2024Inventors: FENG GUO, ZHENG AO, HONGWEI CAI
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Patent number: 9214749Abstract: A pluggable apparatus of a circuit board is provided, which solves the problem that hot plugging of a Peripheral Component Interconnect Express (PCI-E) card is difficult to implement. The pluggable apparatus of the circuit board includes a base plate, a pulling strip, a rotating member, and a carrier plate, where the pulling strip is movably connected to the base plate by using a transverse guide mechanism, sawteeth are formed on a body of the pulling strip, the pulling strip further includes a handle that extends out of the base plate; the rotating member is in a bending line shape; the carrier plate is movably connected to the base plate by using a longitudinal guide mechanism; and a clamping trough is disposed on the carrier plate and is configured to fasten the circuit board.Type: GrantFiled: May 23, 2014Date of Patent: December 15, 2015Assignee: Huawei Technologies Co., Ltd.Inventors: Shuang Li, Yao Li, Feng Ao
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Publication number: 20150076975Abstract: A container data center includes one container body and at least one cabinet set that is arranged in the container body in one direction. Each cabinet set includes at least one cabinet, and a direction in which the at least one cabinet is arranged is perpendicular to the direction in which the cabinet set is arranged. Bottoms of all cabinets in each cabinet set are fastened on one shock absorbing platform, and a bottom of the shock absorbing platform is fastened to a bottom of the container body by using multiple shock absorbers. The container data center can reduce an impact of vibration and a shock on a data center pipe in a transportation process.Type: ApplicationFiled: November 24, 2014Publication date: March 19, 2015Inventors: Yonghui Peng, Feng Ao, Dongli Wang
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Publication number: 20140254086Abstract: A pluggable apparatus of a circuit board is provided, which solves the problem that hot plugging of a Peripheral Component Interconnect Express (PCI-E) card is difficult to implement. The pluggable apparatus of the circuit board includes a base plate, a pulling strip, a rotating member, and a carrier plate, where the pulling strip is movably connected to the base plate by using a transverse guide mechanism, sawteeth are formed on a body of the pulling strip, the pulling strip further includes a handle that extends out of the base plate; the rotating member is in a bending line shape; the carrier plate is movably connected to the base plate by using a longitudinal guide mechanism; and a clamping trough is disposed on the carrier plate and is configured to fasten the circuit board.Type: ApplicationFiled: May 23, 2014Publication date: September 11, 2014Applicant: Huawei Technologies Co., Ltd.Inventors: Shuang Li, Yao Li, Feng Ao
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Publication number: 20140126170Abstract: Embodiments of the present invention disclose a backplane, a cabinet-level communication device, and a method for replacing a backplane, related to the field of mobile communication technologies, and can greatly reduce difficulty in replacing a backplane while ensuring stability of a connection between the backplane and a front board or a rear board. The backplane includes: a base plate of a stripe structure; one or more first connectors arranged on a first face of the base plate and configured to connect a corresponding connector on a front board; and one or more second connectors arranged on a second face of the base plate opposite to the first face and configured to connect a corresponding connector on a rear board.Type: ApplicationFiled: December 31, 2013Publication date: May 8, 2014Applicant: Huawei Technologies Co., Ltd.Inventors: Lei Bai, Feng Ao, Fei Luo
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Patent number: 8226057Abstract: In the field of communication technologies, a fixing device for a holding pole is provided, so as to solve the problem of increased mounting cost due to too much manpower occupied by mounting the fixing device for the holding pole. The fixing device for the holding pole includes a first fastener, a second fastener, and a securing member, two ends of the first fastener are radially engaged with two ends of the second fastener to form a ring, and the securing member rotatably runs through the first fastener or the second fastener to reach the inside of the ring.Type: GrantFiled: June 13, 2011Date of Patent: July 24, 2012Assignee: Huawei Technologies Co., Ltd.Inventors: Feng Ao, Junwei Pan, Bin Wang, Haiping Chen
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Publication number: 20110233373Abstract: In the field of communication technologies, a fixing device for a holding pole is provided, so as to solve the problem of increased mounting cost due to too much manpower occupied by mounting the fixing device for the holding pole. The fixing device for the holding pole includes a first fastener, a second fastener, and a securing member, two ends of the first fastener are radially engaged with two ends of the second fastener to form a ring, and the securing member rotatably runs through the first fastener or the second fastener to reach the inside of the ring.Type: ApplicationFiled: June 13, 2011Publication date: September 29, 2011Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Feng AO, Junwei PAN, Bin WANG, Haiping CHEN
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Publication number: 20100040786Abstract: A process for sealing micro pores of micro-arc oxide film is disclosed in the present disclosure. The process may comprise the following steps: providing a piece of metal having a micro-arc oxide film; preparing a solution including ethyl silicate to make a sealing agent; dipping the metal in the sealing agent to form a coating on the film's surface.Type: ApplicationFiled: June 4, 2009Publication date: February 18, 2010Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: FENG-YUEN DAI, CHWAN-HWA CHIANG, YUNG-TA LO, CHI-CHUANG HO, WEI LIU, XU-FENG AO
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Publication number: 20100040795Abstract: A process for sealing micro pores of micro-arc oxide film is disclosed in the present disclosure. The process may comprise the following steps: providing a metal coated with a micro-arc oxide film; providing a dipping solution including polyester methacrylate monomer for use as a sealing agent; and dipping the metal in the sealing agent to form a coating on the oxide film's surface.Type: ApplicationFiled: June 4, 2009Publication date: February 18, 2010Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: FENG-YUEN DAI, CHWAN-HWA CHIANG, YUNG-TA LO, CHI-CHUANG HO, WEI LIU, XU-FENG AO
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Publication number: 20100040787Abstract: A process for sealing micro pores of micro-arc oxide film is disclosed in the present disclosure. The process may comprise the following steps: providing a metal coated with a micro-arc oxide film; blending a silicone resin and a diluting agent to make a sealing agent; daubing the sealing agent onto the micro-arc oxide film to form a coating on the film's surface.Type: ApplicationFiled: June 4, 2009Publication date: February 18, 2010Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: FENG-YUEN DAI, CHWAN-HWA CHIANG, YUNG-TA LO, CHI-CHUANG HO, WEI LIU, XU-FENG AO
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Publication number: 20090324840Abstract: A process for sealing micro pores of micro-arc oxide film is disclosed. The process comprises the following steps: providing a piece of metal formed with a micro-arc oxide film; blending a polyurethane resin and a firming agent to make a sealing agent; spraying the sealing agent onto the micro-arc oxide film to form a coating on the film's surface. The process can also be: blending an epoxy resin and a firming agent to make a sealing agent to sealing the micro pores by spraying.Type: ApplicationFiled: June 4, 2009Publication date: December 31, 2009Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: FENG-YUEN DAI, YUNG-TA LO, CHI-CHUANG HO, WEI LIU, XU-FENG AO
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Publication number: 20090258234Abstract: A housing includes a plastic substrate, a transparent plastic film, and an intermediate layer sandwiched between the plastic substrate and the transparent plastic film. The intermediate layer includes a metallic coating formed on the transparent film and a protective coating formed on and covering the metallic coating. The plastic substrate is moldingly attached to the protective coating.Type: ApplicationFiled: April 7, 2009Publication date: October 15, 2009Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: CHWAN-HWA CHIANG, YUNG-TA LO, TAO GONG, XU-FENG AO, FENG-YUEN DAI