Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.

Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.

Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: An antenna comprises a ground element, a first transmission element, a feed element, a second transmission element and a third transmission element. The first transmission element is electrically connected to the ground element, wherein the first transmission element comprises at least one coupling portion, a first side and a second side. The feed element corresponds to the coupling portion. The second transmission element corresponds to the first side and is electrically connected to the ground element. The third transmission element corresponds to the second side and is electrically connected to the ground element. When a first wireless signal is transmitted, the feed element couples to the first transmission element to transmit the first wireless signal. When a second wireless signal is transmitted, the feed element couples to the first transmission element, and the second and third transmission elements couple to the first transmission element to transmit the second wireless signal.

Abstract: An antenna includes a ground portion, a radiating element, and an interconnecting element connected to the ground portion and the radiating element. The radiating element includes a first radiating trace including a turning point connected to a first segment and a second segment of the first radiating trace, and a second radiating trace connected to the second segment of the first radiating trace.

Abstract: An antenna structure comprises a substrate, a first conductive element, a feed point, a first extending element, two first radiation elements, two second radiation elements, a ground element, a signal line, and a ground line. The first conductive element is disposed on the substrate and extends in a first direction. The feed point is connected to an end of the first conductive element. The first extending element is connected to another end of the first conductive element opposite to the feed point and extends in the second direction. The first radiation elements are connected to two ends of the first extending element and extend in the first direction. The second radiation elements are connected to the first extending element, near the first radiation elements and extend in the first direction. The ground element is disposed on the substrate. The signal line is coupled to the feed point. The ground line is coupled to the ground element.