Patents by Inventor Feng-Chien Hsu

Feng-Chien Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070270049
    Abstract: A method for forming electrical contacts on an electrical connector having terminals therein includes the steps of preparing a screening board on top of the electrical connector to allow each mesh to align with a center of a top face of each of the terminals of the electrical connector, the screening board having meshes defined therein. Tin paste is applied onto the screening board to allow the tin paste to fill in each of the meshes. Excessive tin paste is removed from the screen board. Then the screening board is removed to leave tin blocks on the centers of the top faces of the terminals of the electrical connector. A heating step is processed to heat the electrical connector. Then electrical contacts are formed on the top faces of the terminals of the electrical connector.
    Type: Application
    Filed: May 19, 2006
    Publication date: November 22, 2007
    Inventors: Feng-Chien Hsu, An-Chyi Liou
  • Patent number: 6732904
    Abstract: A solder ball holding terminal has a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate. The first plate has a first distal end, the second plate has a second distal end and the third plate has a third distal end and a fourth distal end. A distance between the third distal end and the fourth distal end is much smaller than that between the first distal end and the second distal end such that when a solder ball is inserted into a space defined among the first distal end, the second distal end, the third distal end and the fourth distal end, a substantially three-point support is provided to the solder ball so that the solder ball is securely clamped.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: May 11, 2004
    Inventor: Feng-Chien Hsu
  • Publication number: 20040074946
    Abstract: A solder ball holding terminal has a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate. The first plate has a first distal end, the second plate has a second distal end and the third plate has a third distal end and a fourth distal end. A distance between the third distal end and the fourth distal end is much smaller than that between the first distal end and the second distal end such that when a solder ball is inserted into a space defined among the first distal end, the second distal end, the third distal end and the fourth distal end, a substantially three-point support is provided to the solder ball so that the solder ball is securely clamped.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Inventor: Feng-Chien Hsu
  • Publication number: 20030096525
    Abstract: A socket for a PCB has a plurality of apertures and a plurality of connecting strips respectively inserted in the apertures. The connecting strips each have two opposite upright portions; and a lateral portion between the upright portions. Each upright portion has a wall; a protrusion formed at a front side thereof; a neck formed at the top of the wall, extending upward from the wall and bent inward; and a head formed at the top of the neck and having a front end bent outward. A plurality of solder balls is respectively formed under the lateral portions of the connecting strips to bond the connecting strips on a printed circuit board by melting the solder ball.
    Type: Application
    Filed: November 20, 2001
    Publication date: May 22, 2003
    Inventor: Feng-Chien Hsu
  • Publication number: 20030064620
    Abstract: A socket on a printed circuit board has a plurality of apertures. The apertures each have two first stops respectively formed on opposite inner walls, two recesses respectively defined beneath the first stops, and a second stop formed on an inner wall between the first stops. A plurality of connecting strips is respectively inserted in the apertures. The connecting strips each have an upright part. Two protrusions are respectively formed at two opposite sides of the upright part and received in the recesses and blocked by the first stops. A lateral part is formed at the bottom of the upright part and blocked by the second stop. A neck is formed near the top of the upright part, extends upward from the upright part and bent toward the lateral part. A head is formed at the top of the neck and bent away from the lateral part.
    Type: Application
    Filed: October 1, 2001
    Publication date: April 3, 2003
    Inventor: Feng-Chien Hsu
  • Patent number: 6461182
    Abstract: A socket on a PCB has a plurality of apertures. The apertures each have a stop formed on an inner wall, two recesses respectively defined beside the stop, and a rib formed on the stop. A plurality of connecting strips is respectively inserted in the apertures. The connecting strips each have an upright portion formed with two opposed first walls, a second wall extended between the first walls, and an opening. Two protrusions are respectively formed on the two first walls and received in the recesses. A lateral part is formed at the bottom of the upright portion and blocked by the rib. Each first wall includes a body, a head and a neck. The necks are twisted to define an outward taper from the second wall to the opening.
    Type: Grant
    Filed: October 1, 2001
    Date of Patent: October 8, 2002
    Inventor: Feng-Chien Hsu
  • Patent number: 6328587
    Abstract: A contact for fitting in a ZIF socket type connector is formed substantially as an Y-shaped member having a leg extending downward in a vertical direction, a fixing section extending upward in a vertical direction and a flexible contacting section extending upward in an inclined direction. The contacting section is formed as an inverted L-shaped member having a lower end thereof connecting an upper end of the leg and an upper end thereof formed with a horizontal portion, which has a protrusion extending horizontally from one side thereof, and particularly has a rounded edge formed at a lower corner of an outer end of the protrusion. Whereby the contact is able to be accurately inserted into a cavity defined in a base of the connector without any interference so as to ensure transmission quality of the electrical signal.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: December 11, 2001
    Inventor: Feng-Chien Hsu
  • Patent number: 5547389
    Abstract: A socket for receiving an IC chip having ball-shaped pins is disclosed. The socket includes a base having a plurality of through holes defined therein, a sliding cover housing the base and having a central opening for permitting the IC chip to be inserted therethrough, and an actuating rod located between the base and the cover for causing a sliding movement of the cover relative to the base. Each of said through holes has a contacting leg disposed therein and said leg has a first end extending beyond an upper face of the base and a second end extending through a bottom of the base. Said first end has an arcuate surface which is perpendicular to the sliding movement of the IC chip and has a curvature equal to that of the ball-shaped pin of the IC chip so as to make an electrical surface contact with the ball-shaped pin when the IC chip is moved to be fastened on the base.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: August 20, 1996
    Inventor: Feng-chien Hsu
  • Patent number: 5492488
    Abstract: A conductive plate element is positioned in an IC socket which includes a socket base defining a plurality of slots for firmly receiving corresponding number of the conductive plate elements and allowing corresponding number of IC pins inserted therein. The conductive plate element is substantially a fork including a left upper plate and a right upper plate both intersected at a lower flat intersection portion thereof, a shoulder extending outward and substantially perpendicular to the flat intersection portion and being bent downward as a lower plate. The left upper plate and the lower plate are substantially parallel to each other. The right upper plate is twisted in substantially a middle portion thereof thus forming a twisted portion. A contact portion which is substantially flat extends upward from the twisted portion.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: February 20, 1996
    Inventor: Feng-Chien Hsu
  • Patent number: 5425652
    Abstract: A fastening device is installed in an IC socket which includes a cover slidably engaged on a base. The fastening device includes a crank including a lateral rod and a longitudinal rod connected to the lateral rod, the lateral rod being received in between the cover and the base, the longitudinal rod being exposed out of the cover and the base, an upper ear and a lower ear being formed at one side of the cover and each receiving a periphery portion of the longitudinal rod. The lateral rod and the longitudinal rod of the crank have an angle relation less than ninety degrees thus when the longitudinal rod is retained in between the upper ear and the lower ear, a tension between the lateral rod and the longitudinal rod strengthens the retention.
    Type: Grant
    Filed: October 3, 1994
    Date of Patent: June 20, 1995
    Inventor: Feng-Chien Hsu
  • Patent number: 5342214
    Abstract: An IC socket includes a cover slidably engaged to a base. The cover has a plurality of holes formed therethrough for receiving a corresponding number of IC pins. The base has a plurality of slots each of which corresponds to one of the holes of the cover and is retained in communication with the corresponding hole when the cover is slid on the base. A plurality of conductive plate device each of which is respectively positioned in a corresponding slot of the base. Each conductive plate device is substantially a fork including a left upper plate and a right upper plate, both intersected at a lower intersection portion of the conductive plate device. A shoulder extends substantially perpendicular to the intersection portion and bent downward as a lower plate. The right upper plate has a contact portion at the top thereof curved and extended in a direction to the left upper plate thus forming a guiding portion for guiding the IC pin to firmly contact the contact portion.
    Type: Grant
    Filed: November 1, 1993
    Date of Patent: August 30, 1994
    Inventor: Feng-Chien Hsu