Patents by Inventor Feng Chou Kuo

Feng Chou Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240329304
    Abstract: An optical attenuating structure is provided. The optical attenuating structure includes a substrate, a waveguide, doping regions, an optical attenuating member, and a dielectric layer. The waveguide is extended over the substrate. The doping regions are disposed over the substrate, and include a first doping region, a second doping region opposite to the first doping region and separated from the first doping region by the waveguide, a first electrode extended over the substrate and in the first doping region, and a second electrode extended over the substrate and in the second doping region. The first optical attenuating member is coupled with the waveguide and disposed between the waveguide and the first electrode. The dielectric layer is disposed over the substrate and covers the waveguide, the doping regions and the first optical attenuating member.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 3, 2024
    Inventors: HUAN-NENG CHEN, FENG-WEI KUO, MIN-HSIANG HSU, LAN-CHOU CHO, CHEWN-PU JOU, WEN-SHIANG LIAO
  • Patent number: 12095711
    Abstract: An integrated circuit includes first through fourth devices positioned over one or more substrates, a first radio frequency interconnect (RFI) including a first transmitter included in the first device, a first receiver included in the second device, and a first guided transmission medium coupled to each of the first transmitter and the first receiver, a second RFI including a second transmitter included in the first device, a second receiver included in the third device, and a second guided transmission medium coupled to each of the second transmitter and the second receiver, and a third RFI including a third transmitter included in the first device, a third receiver included in the fourth device, and the second guided transmission medium coupled to each of the third transmitter and the third receiver.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: September 17, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Huan-Neng Chen, William Wu Shen, Chewn-Pu Jou, Feng Wei Kuo, Lan-Chou Cho, Tze-Chiang Huang, Jack Liu, Yun-Han Lee
  • Patent number: 12074125
    Abstract: A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground.
    Type: Grant
    Filed: March 21, 2023
    Date of Patent: August 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng Wei Kuo, Wen-Shiang Liao, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen
  • Patent number: 12062629
    Abstract: Systems and methods are provided for an integrated chip. An integrated chip includes a package substrate including a plurality of first layers and a plurality of second layers, each second layer being disposed between a respective adjacent pair of the first layers. A transceiver unit is disposed above the package substrate. A waveguide unit including a plurality of waveguides having top and bottom walls formed in the first layers of the package substrate and sidewalls formed in the second layers of the package substrate.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: August 13, 2024
    Assignees: Taiwan Semiconductor Manufacturing Company Limited, The University of California, Los Angeles (UCLA)
    Inventors: Huan-Neng Chen, Chewn-Pu Jou, Feng Wei Kuo, Lan-Chou Cho, Wen-Shiang Liao, Yanghyo Kim
  • Publication number: 20090244071
    Abstract: Provided is a computer system and a computerized method to automatically generate the synthetic images that simulate the human activities in a particular environment. The program instructions are input in the form of the natural language. Particular columns are provided in the user interface to allow the user to select desired instruction elements from sets of limited candidates. The instruction elements form the program instructions. The system analyzes the program instructions to obtain the standard predetermined time evaluation codes of the instructions. Parameters not include in the input program instructions are generated automatically. Synthetic images are generated by using the input program instructions and the parameters obtained.
    Type: Application
    Filed: July 14, 2008
    Publication date: October 1, 2009
    Applicant: China Motor Corporation.
    Inventors: Chung An Kuo, Feng Chou Kuo, Pei-Chao Chen, Mao-Jiun Wang, Chien-Fu Kuo, Hsu Lee, Shao-Wen Chang