Patents by Inventor Feng-Chun Chung

Feng-Chun Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8027153
    Abstract: A lead frame for a quad flat no-lead package includes a plurality of units arranged in a matrix manner and each having four comers. Each of the corners extends outwards to define an attaching portion for attachment to a UV tape such that four sides of each of the units won't fly off when the sides are cut off.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: September 27, 2011
    Assignee: Lingsen Precision Industries, Ltd.
    Inventor: Feng-Chun Chung
  • Publication number: 20100165596
    Abstract: A lead frame for a quad flat no-lead package includes a plurality of units arranged in a matrix manner and each having four comers. Each of the corners extends outwards to define an attaching portion for attachment to a UV tape such that four sides of each of the units won't fly off when the sides are cut off.
    Type: Application
    Filed: March 26, 2009
    Publication date: July 1, 2010
    Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventor: Feng-Chun Chung
  • Publication number: 20100127368
    Abstract: A lead frame includes a plurality of units arranged in a matrix manner. Each unit has an external frame defining an accommodation area, a die mount pad disposed in the accommodation area of the external frame, a plurality of leads connected with the external frame and arranged around the die mount pad, a short bar having two ends respectively electrically connected with the die mount pad and one of the leads, and a plurality of support bars each having a straight section connected with the external frame, and a continuous curved section connected with the die mount pad. By means of the continuous curved sections of the support bars, thermal deformation and/or displacement of the lead frame can be prevented.
    Type: Application
    Filed: January 29, 2009
    Publication date: May 27, 2010
    Applicant: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventor: Feng-Chun CHUNG